Discrete Three-Dimensional Processor

ABSTRACT

A discrete three-dimensional (3-D) processor comprises first and second dice. The first die comprises 3-D memory (3D-M) arrays, whereas the second die comprises logic circuits and at least an off-die peripheral-circuit component of the 3D-M array(s). Typical off-die peripheral-circuit component could be an address decoder, a sense amplifier, a programming circuit, a read-voltage generator, a write-voltage generator, a data buffer, or a portion thereof.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/249,021, filed Jan. 16, 2019, which claims priorities from thefollowing Chinese patent applications:

1) Chinese Patent Application No. 201811506212.1, filed Dec. 10, 2018;

2) Chinese Patent Application No. 201811508130.0, filed Dec. 11, 2018;

3) Chinese Patent Application No. 201811520357.7, filed Dec. 12, 2018;

4) Chinese Patent Application No. 201811527885.5, filed Dec. 13, 2018;

5) Chinese Patent Application No. 2018115279110.4, filed Dec. 13, 2018;

6) Chinese Patent Application No. 201811528014.5, filed Dec. 14, 2018;

7) Chinese Patent Application No. 201811546476.X, filed Dec. 15, 2018;

8) Chinese Patent Application No. 201811546592.1, filed Dec. 15, 2018;

9) Chinese Patent Application No. 201910002944.5, filed Jan. 2, 2019;

10) Chinese Patent Application No. 201910029523.1, filed Jan. 13, 2019,in the State Intellectual Property Office of the People's Republic ofChina (CN), the disclosures of which are incorporated herein byreferences in their entireties.

BACKGROUND 1. Technical Field of the Invention

The present invention relates to the field of integrated circuit, andmore particularly to a processor.

2. Prior Art

Processors (including CPU, GPU, FPGA, and others) are extensively usedin mathematical computation, computer simulation, configurable gatearray, pattern processing and neural network. A conventional processoris based on two-dimensional (2-D) integration, i.e. its logic circuit(e.g. arithmetic logic unit, control unit) and memory circuit (internalmemory, including RAM for cache and ROM for look-up table) are disposedon a same plane, i.e. the top surface of a semiconductor substrate.Because the arithmetic logic operations are its primary function, theprocessor die contains limited amount of internal memory.

The conventional computer is based on the von Neumann architecture,where processor and memory are physically separated. Most memory takesthe form of external memory (e.g. main memory, secondary memory). Whenit requests a large amount of data, a processor fetches the data from anexternal memory. Because the processor and the external memory aredistant and the system bus between them has a relatively narrow width,data transfer between them has a limited bandwidth. As the amount ofdata increases, the conventional processor and its associated vonNeumann architecture become inefficient.

The following paragraphs will provide an overview of the fields ofapplications of the conventional processors and their limitations.

[A] Mathematical Computing

One important application of processors is mathematical computing,including computing of mathematical functions and mathematical models.For mathematical computing, the conventional processors use logic-basedcomputation (LBC), which carries out computation primarily with logiccircuits (generally known as arithmetic logic unit, or ALU). In fact,the arithmetic operations that can be directly implemented by the ALUconsist of addition, subtraction and multiplication. These arithmeticoperations are collectively referred to as basic arithmetic operations.The ALU's are suitable for arithmetic functions, but not fornon-arithmetic functions. For a processor to compute mathematicalfunctions, an arithmetic function is a mathematical function which canbe represented by a combination of its basic arithmetic operations,whereas a non-arithmetic function is a mathematical function whichcannot be represented by a combination of its basic arithmeticoperations. Exemplary non-arithmetic functions include transcendentalfunctions and special functions. Because it includes more operationsthan the arithmetic operations provided by the ALU's, a non-arithmeticfunction cannot be implemented by the ALU's alone. The hardwareimplementation of the non-arithmetic functions has been a majorchallenge.

For the conventional processors, only few basic functions (i.e.single-variable non-arithmetic functions, e.g. basic algebraic functionsand basic transcendental functions) are implemented by hardware and theyare referred to as built-in functions. These built-in functions arerealized by a combination of logic circuits and look-up tables (LUT). Inprior art, there are many ways to implement built-in functions. Forexample, U.S. Pat. No. 5,954,787 issued to Eun on Sep. 21, 1999 taught amethod for generating SIN/COS functions using LUT's; U.S. Pat. No.9,207,910 issued to Azadet et al. on Dec. 8, 2015 taught a method forcalculating a power function using LUT's.

Realization of built-in functions is further illustrated in FIG. 1AA. Aconventional processor 0X generally comprises a logic circuit 00L and amemory circuit 00M. The logic circuit 00L comprises an ALU forperforming arithmetic operations, while the memory circuit 00M stores anLUT for the built-in function. To obtain a desired precision, thebuilt-in function is approximated to a polynomial of a sufficiently highorder. The LUT 00M stores the coefficients of the polynomial; and theALU 00L calculates the polynomial. Because the ALU 00L and the LUT 00Mare formed side-by-side on a semiconductor substrate 0, this type ofhorizontal integration is referred to as two-dimensional (2-D)integration.

Computation has been developed along the directions of computationaldensity and computational complexity. The computational density is afigure of merit for parallel computation and it refers to thecomputational power (e.g. the number of floating-point operations persecond) per die area. The computational complexity is a figure of meritfor scientific computation and it refers to the total number of built-infunctions supported by a processor. The 2-D integration severely limitscomputational density and computational complexity.

For the 2-D integration, the LUT 00M would increase the die size of theconventional processor 0X and lower its computational density. This hasan adverse effect on parallel computation. Moreover, as the primarycomponent of the conventional processor 0X, the ALU 00L occupies mostdie area. As a result, the LUT 00M is left with a small die area whichcan only accommodate few built-in functions. FIG. 1AB lists all built-intranscendental functions supported by an Intel IA-64 processor(referring to Harrison et al. “The Computation of TranscendentalFunctions on the IA-64 Architecture”, Intel Technical Journal, Q4 1999,hereinafter Harrison). The IA-64 processor supports just a total ofseven built-in functions. This small set of built-in functions makesmathematical computing difficult, because most mathematical functionsneed to be decomposed into a combination of built-in functions. Theconventional processor 0X is slow and inefficient for most mathematicalcomputing.

[B] Computer Simulation

Another important application of processors is computer simulation,which involves computing of mathematical models. As a natural extensionof mathematical computing, computer simulation is built upon the smallset of built-in functions (about ten types) provided by the conventionalprocessor. The framework of the conventional computer simulationcomprises three layers: a foundation layer, a function layer and amodeling layer. The foundation layer includes built-in functions thatcan be directly implemented by hardware. The function layer includesmathematical functions that cannot be directly implemented by hardware.The modeling layer includes mathematical models, which are themathematical descriptions of the behaviors (e.g. input-outputcharacteristics) of a system component.

The mathematical functions in the function layer and the mathematicalmodels in the modeling layer are implemented by software. As mentionedbefore, the function layer involves one software-decomposition step. Onthe other hand, the modeling layer involves two software-decompositionsteps: the mathematical models are decomposed into combinations ofmathematical functions; before the mathematical functions are decomposedinto combinations of built-in functions. Because the mathematical modelsinvolve more software-decomposition steps, their implementations areeven slower and more inefficient than the mathematical functions.

To illustrate how computationally intensive a mathematical model couldbe, FIGS. 1BA-1BB disclose a simple example—the simulation of anamplifier circuit 0Y. The amplifier circuit 0Y comprises a transistor OTand a resistor 0R (FIG. 1BA). All transistor models (e.g. MOS3, BSIM3V3.2, BSIM4 V3.0, PSP of FIG. 1BB) model the transistor behaviors basedon the small set of built-in functions provided by the conventionalprocessor 0X. Due to the limited choice of the built-in functions,calculating even a single current-voltage (I-V) point for the transistorOT requires a large amount of computation (FIG. 1BB). As an example, theBSIM4 V3.0 transistor model needs 222 additions, 286 multiplications, 85divisions, 16 square-root operations, 24 exponential operations, and 19logarithmic operations.

The ALU 00L in the conventional processor 0X can only realize arithmeticmodels per se. Typical mathematical models are non-arithmetic models.For a processor to compute mathematical models, an arithmetic model is amathematical model which can be represented by a combination of itsbasic arithmetic operations, whereas a non-arithmetic model is amathematical model which cannot be represented by a combination of itsbasic arithmetic operations. Because it includes more operations thanthe arithmetic operations provided by the ALU 00L, a non-arithmeticmodel cannot be implemented by the ALU alone. Computation ofnon-arithmetic models by the conventional processor 0X is extremely slowand inefficient.

[C] Configurable Gate Array

A third application of processors is configurable gate array. Aconfigurable gate array is a semi-custom integrated circuit designed tobe configured by a customer after manufacturing. It is also referred toas field-programmable gate array (FPGA), complex programmable logicdevice (CPLD), or other names. U.S. Pat. No. 4,870,302 issued to Freemanon Sep. 26, 1989 (hereinafter referred to as Freeman) discloses aconfigurable gate array. It contains an array of configurable logicelements (CLE's, also known as configurable logic blocks) and ahierarchy of configurable interconnects (CIT's, also known asprogrammable interconnects) that allow the CLE's to be wired togetherper customer's desire. Each CLE in the array is in itself capable ofrealizing any one of a plurality of logic functions (e.g. shift, logicNOT, logic AND, logic OR, logic NOR, logic NAND, logic XOR, arithmeticaddition “+”, arithmetic subtraction “−”, etc.) depending upon a firstconfiguration signal. On the other hand, each CIT can selectively coupleor de-couple interconnect lines depending upon a second configurationsignal.

In a configurable gate array, the arithmetic operations (i.e. arithmeticaddition and arithmetic subtraction) provided by the CLE are alsocollectively referred to as basic arithmetic operations. They are fewerthan those provided by the conventional processor (i.e. addition,subtraction and multiplication). As used hereinafter, basic arithmeticoperations could refer to either those provided by the configurable gatearray, or those provided by the conventional processor, depending on thecontext.

The configurable gate array can customize logic functions and arithmeticfunctions, but not non-arithmetic functions. In the configurable gatearray, an arithmetic function is a mathematical function which can berepresented by a combination of its basic arithmetic operations;whereas, a non-arithmetic function is a mathematical function whichcannot be represented by a combination of its basic arithmeticoperations. Because the non-arithmetic functions include more operationsthan basic arithmetic operations, they cannot be directly implemented bythe CLE's alone. It was generally believed that customization ofnon-arithmetic functions is impossible.

[D] Pattern Processing

A fourth application of processors is pattern processing. Patternprocessing includes pattern matching and pattern recognition, which arethe acts of searching a target pattern (i.e. the pattern to be searched)for the presence of the constituents or variants of a search pattern(i.e. the pattern used for searching). The match usually has to be“exact” for pattern matching, whereas it could be “likely to a certaindegree” for pattern recognition. As used hereinafter, search patternsand target patterns are collectively referred to as patterns; patterndatabase refers to a database containing related patterns. Patterndatabase includes search-pattern database (also known as search-patternlibrary) and target-pattern database.

Pattern processing has broad applications. Typical pattern processingincludes code matching, string matching, speech recognition and imagerecognition. Code matching is widely used in information security. Itsoperations include searching a virus in a network packet or a computerfile; or, checking if a network packet or a computer file conforms to aset of rules. String matching, also known as keyword search, is widelyused in big-data analytics. Its operations include regular-expressionmatching. Speech recognition identifies from the audio data the nearestacoustic/language model in an acoustic/language model library. Imagerecognition identifies from the image data the nearest image model in animage model library.

The pattern database has become large: the search-pattern library(including related search patterns, e.g. a virus library, a keywordlibrary, an acoustic/language model library, an image model library) isalready big; while the target-pattern database (including related targetpatterns, e.g. computer files on a whole disk drive, a big-datadatabase, an audio archive, an image archive) is even bigger. Theconventional processor and its associated von Neumann architecture havegreat difficulties to perform fast pattern processing on large patterndatabases.

[E] Neural Network

A fifth application of processors is neural network. Neural network is apowerful tool for artificial intelligence (AI). An exemplary neuralnetwork is shown in FIG. 1C. It includes an input layer 32, a hiddenlayer 34 and an output layer 36. The input layer 32 comprises i neurons33, whose input data x₁, . . . x_(i) form an input vector 30 x. Theoutput layer 36 comprises k neurons 37, whose output data y₁, y₂, . . .y_(k) form an output vector 30 y. The hidden layer 34 is between theinput layer 32 and the output layer 36. It comprises j neurons 35, eachof which is coupled with a first neuron in the input layer 32 as well asa second neuron in the output layer 36. The couplings between neuronsare represented by synaptic weights w_(ij) and w_(jk).

A machine-learning supercomputer comprising a plurality of acceleratordice 60 is disclosed in prior art (referring to Chen et al. “DaDianNao:A Machine-Learning Supercomputer”, IEEE/ACM International Symposium onMicro-architecture, 5(1), pp. 609-622, 2014). Each accelerator die 60comprises an array of sixteen tiles 50, which are connected through afat tree (FIG. 1DA). Each tile 50 comprises a neuro-processing unit(NPU) 30 and four eDRAM banks 40 (FIG. 1DB). The NPU 30 performs neuralprocessing. It comprises 256+32 16-bit multipliers as well as 256+3216-bit adders. The eDRAM 40 stores the synaptic weights. It has astorage capacity of 2 MB.

The accelerator 60 has several drawbacks. First of all, because theeDRAM 40 is a volatile memory, the synaptic weights need to be loadedinto the eDRAM 40 before operations. This takes time. Secondly, eachaccelerator die 60 contains 32 MB eDRAM. This number is still quitesmall for many neural networks. Thirdly, the accelerator 60 adopts anasymmetric architecture where the tile area is heavily biased towardsstorage rather than computation. Inside each tile, eDRAM 40 occupiesnearly 80% of the area, whereas the NPU 30 only occupies less than 10%.As a result, the computational density is limited.

With the advent of three-dimensional memory (3D-M), the abovedifficulties are alleviated (mentioned in applications [A]-[E]). For a3D-M, its memory cells are disposed in a three-dimensional (3-D) space,i.e. stacked along a direction perpendicular to the top surface of thesubstrate. U.S. Pat. No. 6,861,715 B2 issued to Zhang on Mar. 1, 2005discloses an integrated 3-D processor, where a logic circuit ismonolithically integrated underneath the 3D-M arrays. The integrated 3-Dprocessor is, by itself, a single 3-D processor die.

The integrated 3-D processor can be applied to above fields ofapplications. U.S. patent application Ser. No. 15/487,366, filed Apr.13, 2017, discloses an integrated 3-D processor for computingmathematical functions and mathematical models; U.S. Pat. No. 9,838,021,issued Dec. 5, 2017, discloses an integrated 3-D processor as aconfigurable computing array; U.S. patent application Ser. No.15/452,728, filed Mar. 3, 2017, discloses an integrated 3-D processor asa pattern processor; U.S. patent application Ser. No. 15/464,347, filedMar. 21, 2017, discloses an integrated 3-D processor as aneuro-processor. The integrated 3-D processor brings about significantadvantages in these fields.

FIGS. 1EA-1EB disclose an integrated 3-D processor die 80. It comprisesat least a 3D-M array 77 and a logic circuit 78 integrated therewith.The 3D-M array 77 stores data, while the logic circuit 78 processes atleast a portion of the data stored in the 3D-M array 77. On the 3-Dprocessor die 80, the die area occupied by the 3D-M arrays 77 is amemory region 70, whereas the die area outside the 3D-M arrays 77 is anon-memory region 71 (FIG. 1EA). The memory region 70 comprises asubstrate circuit 0K and a 3D-M array 77 stacked thereon (FIG. 1EB). Thesubstrate circuit 0K includes transistors 0 t and substrateinterconnects 0 i. The transistors 0 t are formed in a semiconductorsubstrate 0 and communicatively coupled by the substrate interconnects 0i. The substrate interconnects 0 i include two interconnect layers 0 m1-0 m 2, each of which comprises a plurality of interconnects 0 m on asame physical plane. The 3D-M arrays 77 include four address-line layers0 a 1-0 a 4. Each address-line layer (e.g. 0 a 1) comprises a pluralityof address lines (e.g. 1 a) on a same physical plane. The address-linelayers 0 a 1-0 a 4 form two memory levels 16A, 16B, with the memorylevel 16A stacked on the substrate circuit 0K and the memory level 16Bstacked on the memory level 16A. Memory cells (e.g. 7 aa) are disposedat the intersections between two address lines (e.g. 1 a, 2 a). Thememory levels 16A, 16B are communicatively coupled with the substratecircuit 0K through contact vias 1 av, 3 av.

The non-memory region 71 also contains a portion of substrate circuit 0K(FIG. 1EB). Without the 3D-M array 77, the non-memory region 71comprises substantially fewer back-end-of-line (BEOL) layers than thememory region 70. As used hereinafter, a BEOL layer is an independentconductive layer (not counting via) in the BEOL. In FIG. 1EB, the memoryregion 70 contains six BEOL layers, including two interconnect layers 0m 1-0 m 2 of the substrate circuit 0K, and four address-line layers 0 a1-0 a 4 of the 3D-M array 77, while the non-memory region 71 containsonly two BEOL layers, including the two interconnect layers 0 m 1-0 m 2of the substrate circuit 0K. Because it contains neither memory cellsnor interconnects, the space 72 above the substrate circuit 0K is, infact, wasted.

The memory region 70 contains a plurality of 3D-M arrays 77 and theassociated local peripheral circuit 75 and logic circuit 78 (FIG. 1EA).The local peripheral circuit 75 and the logic circuit 78 are disposed onthe substrate 0 and located near the footprint of the 3D-M array 77.Because they are vertically stacked above the substrate 0 (not formed onthe substrate 0), the 3D-M arrays 77 are drawn by dashed lines. On theother hand, the non-memory region 71 contains at least a globalperipheral circuit 73 of the 3D-M arrays 77. They are disposed on thesubstrate 0 and located outside the footprints of all 3D-M arrays 77.The local peripheral circuit 75 and global peripheral circuit 73 arecollectively referred to peripheral circuits 79.

In the 3-D processor die 80, the non-memory region 71 occupies a largedie area. At present, the non-memory region 71 occupies 20%-30% of thetotal die area. As the storage capacity increases, the number will soonreach 50%. Hence, the integrated 3-D processor 80 has a low arrayefficiency. As used hereinafter, the array efficiency is the ratio ofthe total footprints of the 3D-M arrays 77 on the substrate 0 and thetotal die area.

The prevailing belief in integrated circuits is that integration willlower the cost and improve performance. Accordingly, monolithicintegration, which integrates all circuit components into a single die,is generally preferred. Monolithic integration is advantageous totwo-dimensional (2-D) circuits, but not so to three-dimensional (3-D)circuits, more particularly when the 3-D circuits (e.g. 3D-M arrays) aremixed with the 2-D circuits. As used hereinafter, a 2-D circuit is acircuit whose active elements (e.g. transistors, memory cells) aredisposed on a 2-D plane (e.g. on a top surface of a semiconductorsubstrate); whereas, a 3-D circuit is a circuit whose active elements(e.g. transistors, memory cells) are disposed in a 3-D space (i.e.stacked along a direction perpendicular to a top surface of asemiconductor substrate).

Monolithic integration, when applied to the integration of the 3-Dcircuits and 2-D circuits, has several drawbacks. First of all, becausetheir manufacturing processes are not compatible, integration will forcethe logic circuit 78 and the peripheral circuit 79 to use the expensivemanufacturing process for the 3D-M arrays 77. Adding the fact that itsarray efficiency is lower, the overall cost of the integrated 3-Dprocessor die 80 becomes higher.

To make things worse, because the 3D-M arrays 77 have stringentrequirements on manufacturing, the BEOL process of the integrated 3-Dprocessor die 80 is generally optimized for the 3D-M arrays 77, at theprice of the performance of the logic circuit 78 and the peripheralcircuit 79. For the integrated 3-D processor 80, the logic circuit 78and the peripheral circuit 79 can only contain a small number of theinterconnect layers (as few as two); or, use slower high-temperatureinterconnect materials (which support the high-temperature manufacturingprocess for the 3D-M arrays 77, e.g. tungsten). As a result, the overallperformance of the integrated 3-D processor die 80 suffers.

Finally, with monolithic integration, the die area occupied by the locallogic circuit 76 (i.e. the logic circuit under the 3D-M array) islimited by the footprint of the 3D-M array 77. As a result, the locallogic circuit 76 has limited functionalities. Furthermore, becausemonolithic integration fixedly integrates the 3D-M arrays 77 with thelogic circuit 78, the integrated 3-D processor 80 can only perform fixedfunctions. To perform another function, the whole 3-D processor 80 needsto be re-designed and re-manufactured, which are time-consuming andexpensive.

Objects and Advantages

It is a principle object of the present invention to provide a 3-Dprocessor with a lower overall cost.

It is a further object of the present invention to provide a 3-Dprocessor with a better overall performance.

It is a further object of the present invention to provide a 3-Dprocessor with more processing power and more flexible functionalities.

It is a further object of the present invention to provide a 3-Dprocessor with more computational density.

It is a further object of the present invention to provide a 3-Dprocessor with more computational complexity.

It is a further object of the present invention to improve the speed andefficiency of mathematical computing.

It is a further object of the present invention to improve the speed andefficiency of computer simulation.

It is a further object of the present invention to customizenon-arithmetic functions.

It is a further object of the present invention to realizere-configurable computing.

It is a further object of the present invention to improve the speed andefficiency of pattern processing on large pattern databases.

It is a further object of the present invention to enhance informationsecurity.

It is a further object of the present invention to improve the speed andefficiency of big-data analytics.

It is a further object of the present invention to improve the speed andefficiency of speech recognition, as well as enable audio search in anaudio archive.

It is a further object of the present invention to improve the speed andefficiency of image recognition, as well as enable video search in avideo archive.

It is a further object of the present invention to improve the speed andefficiency of neural processing.

In accordance with these and other objects of the present invention, thepresent invention discloses a discrete 3-D processor.

SUMMARY OF THE INVENTION

The present invention follows a design paradigm distinct from anyconventional processor: de-integrate the 2-D and 3-D circuits. To bemore specific, the 2-D circuits and the 3-D circuits are partitionedinto different dice as much as possible so that they can be optimizedseparately. Accordingly, the present invention discloses a discrete 3-Dprocessor, comprising: a plurality of storage-processing units (SPU's),each of said SPU's comprising at least a three-dimensional memory (3D-M)array and a logic circuit; first and second dice, wherein said first diecomprises said 3D-M array, said second die comprises at least a portionof said logic circuit and an off-die peripheral-circuit component ofsaid 3D-M array, said first die does not comprise said off-dieperipheral-circuit component, said first and second dice are separatedice communicatively coupled by a plurality of inter-die connections.Simply put, the first die is a memory die with multiple functionalphysical levels, whereas the second die is a logic die with a singlefunctional physical level.

Different from the integrated 3-D processor where all peripheral-circuitcomponents are located in the same die as the 3D-M arrays, at least oneperipheral-circuit component of the 3D-M arrays is not located in thefirst die, but located in the second die. Accordingly, thisperipheral-circuit component located in the second die is referred to asan off-die peripheral-circuit component. During design, the discrete 3-Dprocessor is partitioned in such a way that the second die comprises asmany off-die peripheral-circuit components as possible. Apparently, thispartitioning scheme improves the array efficiency of the first die. Itshould be noted that, although it comprises the 3D-M arrays, the firstdie per se is not a functional memory die because of the missingperipheral-circuit components. Its performance cannot meet theindustrial standards of the memory product of the same type.

Designed and manufactured separately, the first and second dice havesubstantially different BEOL structures. Because the BEOL structures ofthe second die could be independently optimized, the off-dieperipheral-circuit components and the logic circuits could have a lowercost and a better performance than their counterparts in the integrated3-D processor. In the following paragraphs, the discrete 3-D processoris compared with the integrated 3-D processor in several aspects.

First of all, because it does not include at least a portion of theperipheral circuits and logic circuits, the first die has a better arrayefficiency. In addition, as a 2-D circuit, the second die comprisessubstantially fewer BEOL layers than the integrated 3-D processor andcan be made with the conventional manufacturing process. Because thewafer cost is roughly proportional to the number of BEOL layers, thesecond die would have a much lower wafer cost than the integrated 3-Dprocessor. Hence, the total die cost of the discrete 3-D processor(which includes first and second dice) is lower than that of theintegrated 3-D processor (which includes a single die). Even with theextra bonding cost, the discrete 3-D processor still has a lower overallcost than the integrated 3-D processor for a given storage capacity.

Secondly, because they can be independently optimized, the off-dieperipheral-circuit components and the logic circuits of the discrete 3-Dprocessor have a better performance than their counterparts in theintegrated 3-D processor. In one preferred embodiment, the number of theinterconnect layers (e.g. four, eight, or even more) in the second dieis more than that of the substrate circuits (e.g. two) of the integrated3-D processor die (or, the first die). In another preferred embodiment,the second die comprises high-speed interconnect materials (e.g.copper), not the high-temperature interconnect materials (e.g. tungsten)used in the integrated 3-D processor (or, the first die), which aregenerally slower. As a result, the discrete 3-D processor has a betteroverall performance than the integrated 3-D processor.

Lastly, in the integrated 3-D processor, the logic circuit is smallerand has less processing power, because it is disposed in a single die(e.g. within the footprint of the 3D-M array on the substrate). Incomparison, in the discrete 3-D processor, the logic circuit is largerand has more processing power, because it can be disposed in two dice(e.g. a first portion of the logic circuit is disposed in the projectionof the 3D-M array on the second die; and, a second portion of the logiccircuit is disposed in the second die). In addition, designed andmanufactured separately, the second die enjoys more flexibility indesign and manufacturing. By combining the same first die with differentsecond dice, different functionalities can be realized for differentapplications. Better yet, these different functionalities can beimplemented in a relatively short time and under a relatively smallbudget. As a result, the discrete 3-D processor has more processingpower and more flexible functionalities than the integrated 3-Dprocessor.

The following paragraphs provide an overview of the applications of thepreferred discrete 3-D processor.

[A] Mathematical Computing

When applied to the mathematical computing, the preferred discrete 3-Dprocessor computes non-arithmetic functions. It uses memory-basedcomputation (MBC), which carries out computation primarily with the LUTstored in the 3D-M arrays (i.e. 3DM-LUT). Compared with the conventionallogic-based computation (LBC), the 3DM-LUT used by the MBC has a muchlarger capacity than the conventional LUT. For example, a single3D-XPoint die has a storage capacity of 128 Gb, far larger than anyconventional LUT (tens of kb). It can be used to store tens of thousandsof non-arithmetic functions, including various types of transcendentalfunctions and special functions. Although arithmetic operations arestill performed for most MBC's, using a larger 3DM-LUT as a startingpoint, the MBC only needs to calculate a polynomial to a smaller order.For the MBC, the fraction of computation done by the memory circuit issignificantly more than the logic circuit.

Accordingly, the present invention discloses a discrete 3-D processorfor computing at least a non-arithmetic function, comprising: aplurality of storage-processing units (SPU's), each of said SPU'scomprising at least a three-dimensional memory (3D-M) array and anarithmetic logic circuit (ALC), wherein said 3D-M array stores at leasta portion of a look-up table (LUT) for said non-arithmetic function,said ALC performs arithmetic operations on selected data from said LUT;first and second dice, wherein said first die comprises said 3D-M array,said second die comprises at least a portion of said ALC and an off-dieperipheral-circuit component of said 3D-M array, said first die does notcomprise said off-die peripheral-circuit component, said first andsecond dice are separate dice communicatively coupled by a plurality ofinter-die connections; wherein said non-arithmetic function includesmore operations than the arithmetic operations provided by said ALC.

[B] Computer Simulation

When applied to the computer simulation, the preferred discrete 3-Dprocessor computes non-arithmetic models. It still uses the MBC. The MBCbrings about significant performance improvement for computersimulation. With significantly more built-in functions (from about tentypes to tens of thousands), the prevailing framework of computersimulation (including the foundation, function and modeling layers) isflattened. The hardware-implemented functions, which were only availableto the foundation layer, now become available to the function andmodeling layers. Not only mathematical functions in the function layercan be directly realized by hardware, but also mathematical models inthe modeling layer. In the function layer, mathematical functions can becomputed by a function-by-LUT method, i.e. the function values arecalculated by reading the 3DM-LUT plus polynomial interpolation. In themodeling layer, mathematical models can be computed by a model-by-LUTmethod, i.e. the input-output characteristics of a system component arecalculated by reading the 3DM-LUT plus polynomial interpolation. Rapidand efficient computation through 3DM-LUT would lead to a paradigm shiftfor computer simulation.

Accordingly, the present invention discloses a discrete 3-D processorfor computing at least a non-arithmetic model, comprising: a pluralityof storage-processing units (SPU's), each of said SPU's comprising atleast a three-dimensional memory (3D-M) array and an arithmetic logiccircuit (ALC), wherein said 3D-M array stores at least a portion of alook-up table (LUT) for said non-arithmetic model, said ALC performsarithmetic operations on selected data from said LUT; first and seconddice, wherein said first die comprises said 3D-M array, said second diecomprises at least a portion of said ALC and an off-dieperipheral-circuit component of said 3D-M array, said first die does notcomprise said off-die peripheral-circuit component, said first andsecond dice are separate dice communicatively coupled by a plurality ofinter-die connections; wherein said non-arithmetic model includes moreoperations than the arithmetic operations provided by said ALC.

[C] Configurable Computing Array

When applied to configurable gate array, the preferred discrete 3-Dprocessor is a discrete 3-D configurable computing array. It can notonly customize logic functions and arithmetic functions, but alsocustomize non-arithmetic functions. Accordingly, the present inventiondiscloses a discrete 3-D configurable computing array for customizing atleast a non-arithmetic function, comprising: an array of configurablelogic elements (CLE's) and/or configurable interconnects (CIT's); anarray of configurable computing elements (CCE's) comprising at least athree-dimensional memory (3D-M) array for storing at least a portion ofa look-up table (LUT) of said non-arithmetic function; first and seconddice, wherein said first die comprises said 3D-M array, said second diecomprises at least a portion of said array of CLE's/CIT's and an off-dieperipheral-circuit component of said 3D-M array, said first die does notcomprise said off-die peripheral-circuit component, said first andsecond dice are separate dice communicatively coupled by a plurality ofinter-die connections; whereby said non-arithmetic function iscustomized by programming said array of CLE's/CIT's and said array ofCCE's; wherein said non-arithmetic function includes more operationsthan the arithmetic operations provided by said CLE.

The usage cycle of the CCE comprises two stages: a configuration stageand a computation stage. At the configuration stage, the LUT for anon-arithmetic function is loaded into the 3D-M array. At thecomputation stage, the values of the non-arithmetic function are readout from the LUT. For an electrically re-programmable 3D-M, differentnon-arithmetic functions can be realized by loading the LUT's ofdifferent non-arithmetic functions into the 3D-M array at differentusage cycles. Hence, re-configurable computing can be realized.

[D] Pattern Processing

When applied to pattern processing, the preferred discrete 3-D processoris a discrete 3-D pattern processor. Its basic functionality is patternprocessing. More importantly, the patterns it processes are storedlocally. Because the pattern-storage circuit is close to thepattern-processing circuit, it takes a short time to read new patterns.In addition, the preferred 3-D pattern processor comprises tens ofthousands of storage-processing units (SPU's). During patternprocessing, the input data are sent to all SPU's and processedsimultaneously, thus achieving massive parallelism. The preferred 3-Dpattern processor can realize fast and efficient pattern processing forlarge pattern databases.

Accordingly, the present invention discloses a discrete 3-D patternprocessor, comprising: an input for transferring a first portion of afirst pattern; a plurality of storage-processing units (SPU's)communicatively coupled with said input, each of said SPU's comprisingat least a three-dimensional memory (3D-M) array and apattern-processing circuit, wherein said 3D-M array stores at least asecond portion of a second pattern, said pattern-processing circuitperforms pattern processing for said first and second patterns; firstand second dice, wherein said first die comprises said 3D-M array, saidsecond die comprises at least a portion of said pattern-processingcircuit and an off-die peripheral-circuit component of said 3D-M array,said first die does not comprise said off-die peripheral-circuitcomponent, said first and second dice are separate dice communicativelycoupled by a plurality of inter-die connections.

[E] Neural Processing

When applied to neural network, the preferred discrete 3-D processor isa discrete 3-D neuro-processor. Its basic functionality is neuralprocessing. More importantly, the synaptic weights required for neuralprocessing are stored locally. Because the memory storing the synapticweights is close to the neuro-processing circuit, it takes a short timeto read synaptic weights. In addition, the preferred 3-D neuro-processorcomprises tens of thousands of storage-processing units (SPU's). Duringneural processing, the input data are sent to all SPU's and processedsimultaneously, thus achieving massive parallelism. The preferred 3-Dneural process can realize fast and efficient neural processing.

Accordingly, the present invention discloses a discrete 3-Dneuro-processor, comprising: a plurality of storage-processing units(SPU's), each of said SPU's comprising at least a three-dimensionalmemory (3D-M) array and a neuro-processing circuit, wherein said 3D-Marray stores at least a synaptic weight, said neuro-processing circuitperforms neural processing with said synaptic weight; first and seconddice, wherein said first die comprises said 3D-M array, said second diecomprises at least a portion of said neuro-processing circuit and anoff-die peripheral-circuit component of said 3D-M array, said first diedoes not comprise said off-die peripheral-circuit component, said firstand second dice are separate dice communicatively coupled by a pluralityof inter-die connections.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1AA is a schematic view of a conventional processor (prior art);FIG. 1AB lists all transcendental functions supported by an Intel IA-64processor (prior art); FIG. 1BA is a circuit block diagram of anamplifier circuit; FIG. 1BB lists number of operations to calculate acurrent-voltage (I-V) point for various transistor models (prior art);FIG. 1C is a schematic view of a neural network; FIG. 1DA shows the tileorganization of an accelerator used in a machine-learning supercomputer(prior art); FIG. 1DB shows a tile architecture of the accelerator ofFIG. 1DA (prior art); FIG. 1EA is a plan view of an integrated 3-Dprocessor (prior art); FIG. 1EB is its cross-sectional view;

FIG. 2A is a circuit block diagram of a preferred discrete 3-Dprocessor; FIG. 2B is a circuit block diagram of a preferredstorage-processing unit (SPU); FIG. 2C is a circuit layout view of twodice in the preferred discrete 3-D processor;

FIGS. 3A-3D are cross-sectional views of two dice in four preferreddiscrete 3-D processors;

FIGS. 4A-4D are cross-sectional views of four preferred first dice;

FIG. 5 is a cross-sectional view of a preferred second die;

FIG. 6A is a circuit layout view of a preferred first die; FIGS. 6BA-6BBare circuit layout views of two preferred second dice;

FIGS. 7A-7C are circuit block diagrams of three preferred SPU's;

FIGS. 8A-8C are circuit layout views of three preferred SPU's on thefirst and second dice;

FIG. 9 is a circuit block diagram of a computing element in a preferreddiscrete 3-D processor for computing non-arithmetic functions or models;

FIGS. 10A-10C are the circuit block diagrams of three preferred ALC's;

FIG. 11A is a circuit block diagram of a first preferred computingelement; FIG. 11B is a detailed circuit diagram of the first preferredcomputing element;

FIG. 12 is a circuit block diagram of a second preferred computingelement;

FIG. 13 is a circuit block diagram of a third preferred computingelement;

FIG. 14A is a circuit block diagram of a configurable block used in apreferred 3-D configurable computing array; FIG. 14B lists thefunctional blocks in the configurable block;

FIGS. 15A-15B are circuit block diagrams of two preferred configurablecomputing elements (CCE's);

FIG. 16 discloses two usage cycles of a preferred re-configurablecomputing element;

FIG. 17A shows an interconnect library supported by a preferredconfigurable interconnect (CIT); FIG. 17B shows a logic librarysupported by a preferred configurable logic element (CLE);

FIG. 18 is a circuit block diagram of a first preferred 3-D configurablecomputing array;

FIG. 19 shows an instantiation of the first preferred 3-D configurablecomputing array;

FIG. 20 is a circuit block diagram of a second preferred 3-Dconfigurable computing array;

FIGS. 21A-21B show two instantiations of the second preferred 3-Dconfigurable computing array;

FIG. 22 is a circuit block diagram of a preferred discrete 3-D parallelprocessor;

FIG. 23 is a circuit block diagram of a SPU in a preferred discrete 3-Dpattern processor;

FIG. 24 is a circuit block diagram of a SPU in a preferred discrete 3-Dneuro-processor;

FIG. 25 is a circuit block diagram of a preferred neuro-processingcircuit;

FIGS. 26A-26B are circuit block diagrams of two preferred computingcircuits.

It should be noted that all the drawings are schematic and not drawn toscale. Relative dimensions and proportions of parts of the devicestructures in the figures have been shown exaggerated or reduced in sizefor the sake of clarity and convenience in the drawings. The samereference symbols are generally used to refer to corresponding orsimilar features in the different embodiments.

As used hereinafter, the symbol “/” means the relationship of “and” or“or”. The phrase “memory” is used in its broadest sense to mean anysemiconductor device, which can store information for short term or longterm. The phrase “memory array (e.g. 3D-M array)” is used in itsbroadest sense to mean a collection of all memory cells sharing at leastan address line. The phrase “circuits on a substrate” is used in itsbroadest sense to mean that all active elements (e.g. transistors,memory cells) or portions thereof are located in the substrate, eventhough the interconnects coupling these active elements are locatedabove the substrate. The phrase “circuits above a substrate” is used inits broadest sense to mean that all active elements (e.g. transistors,memory cells) are located above the substrate, not in the substrate. Thephrase “communicatively coupled” is used in its broadest sense to meanany coupling whereby electrical signals may be passed from one elementto another element. The phrase “look-up table (LUT) (including 3DM-LUT)”could refer to either the data in the LUT, or the memory circuit storingthe LUT (i.e. the LUT memory); the present invention does notdifferentiate them. The phrase “pattern” could refer to either patternper se, or the data related to a pattern; the present invention does notdifferentiate them.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Those of ordinary skills in the art will realize that the followingdescription of the present invention is illustrative only and is notintended to be in any way limiting. Other embodiments of the inventionwill readily suggest themselves to such skilled persons from anexamination of the within disclosure.

Referring now to FIGS. 2A-2C, an overview of a preferred discrete 3-Dprocessor 100 is disclosed. FIG. 2A is its circuit block diagram. Thepreferred discrete 3-D processor 100 not only processes data, but alsostores data. More importantly, most data it processes are stored locallyand in close proximity. The preferred discrete 3-D processor 100comprises an array with m rows and n columns (m×n) of storage-processingunits (SPU's) 100 aa-100 mn. Using the SPU 100 ij as an example, it hasan input 110 and an output 120. In general, the preferred discrete 3-Dprocessor 100 comprises thousands to tens of thousands of SPU's 100aa-100 mn and therefore, it supports massive parallelism.

FIG. 2B is a circuit block diagram of a preferred SPU 100 ij. The SPU100 ij comprises a memory circuit 170 and a logic circuit 180, which arecommunicatively coupled by inter-die connections 160 (referring to FIGS.3A-3D). The memory circuit 170 comprises at least a 3D-M array. The 3D-Marray 170 stores data, whereas the logic circuit 180 processes at leasta portion of these data. Because the 3D-M array 170 is disposed on adifferent die than the logic circuit 180 (referring to FIG. 2C), the3D-M array 170 is drawn by dashed lines.

FIG. 2C shows a preferred implementation of the preferred discrete 3-Dprocessor 100. It comprises a first die (also known as memory die) 100 aand at least a second die (also known as logic die) 100 b. The first die100 a comprises 3-D circuits, i.e. the 3D-M arrays 170. The second die100 b comprises 2-D circuits, e.g. at least a logic circuit 180 and aperipheral-circuit component 190 of the 3D-M array 170. The inter-dieconnections 160 communicatively couple the first and second dice 100 a,100 b. Since the peripheral-circuit component 190 is disposed on adifferent die than the 3D-M arrays 170, it is referred to as an off-dieperipheral-circuit component. Note that a portion of the logic circuitmay be disposed on the first die 100 a, e.g. this portion of the logiccircuit may be disposed underneath the 3D-M array 170. For reason ofsimplicity, unless being pointed out specifically, the logic circuit inthis specification refers to the logic circuit 180 on the second die 100b.

The preferred discrete 3-D processor 100 is partitioned in such a waythat the second die 100 b comprises as many off-die peripheral-circuitcomponents 190 as possible. The peripheral-circuit component is anessential circuit without which a memory die (e.g. the first die 100 a)cannot perform even the basic memory functions (for example, itsperformance cannot meet the industrial standards of the memory productof the same type). Typical off-die peripheral-circuit component 190could be an address decoder, a sense amplifier, a programming circuit, aread-voltage generator, a write-voltage generator, a data buffer, or aportion thereof.

The read/write-voltage generator converts an external power supply intoa read/write voltage of the 3D-M array 170, which generally has adifferent value than the external power supply. The read/write-voltagegenerator preferably uses a DC-to-DC converter. It could be a step-upcircuit, whose output voltage is higher than the input voltage, or astep-down circuit, whose output voltage is lower than the input voltage.Examples of the step-up circuits include a charge-pump circuit and aboost converter, and examples of the step-down circuits include a lowdropout circuit and a buck converter.

The address/data-translator converts the logic address/data (viewed froman external user or a host) into the physical address/data for the 3D-Marray 170, or vice versa. The address translator generally comprises anon-volatile memory for storing an address mapping table, a faulty blocktable, a wear-management table or others. On the other hand, the datatranslator generally comprises an ECC-encoder and/or an ECC-decoder. Tothose skilled in the art, other forms of the peripheral-circuitcomponents 190 may be used.

Referring now to FIGS. 3A-3D, four preferred discrete 3-D processors 100are shown with focus on the implementations of inter-die connections160. In FIG. 3A, the first and second dice 100 a, 100 b are verticallystacked, i.e. stacked along the direction perpendicular to the dice 100a, 100 b. Both the first and second dice 100 a, 100 b face upward (i.e.along the +z direction). They are communicatively coupled by the bondwires 160 w, which realize the inter-die connections 160.

In FIG. 3B, the first and second dice 100 a, 100 b are placedface-to-face, i.e. the first die 100 a faces upward (i.e. along the +zdirection), while the second die is flipped so that it faces downward(i.e. along the −z direction). They are communicatively coupled by themicro-bumps 160 x, which realize the inter-die connections 160. In thispreferred embodiment, the first and second dice 100 a, 100 b have samedie sizes. All edges of the first and second dice 100 a, 100 b arevertically aligned. For example, the left edge of the first die 100 a isvertically aligned with the left edge of the second die 100 b; and, theright edge of the first die 100 a is vertically aligned with the rightedge of the second die 100 b. This is due to the fact that the preferreddiscrete 3-D processor 100 is diced from bonded wafers (which bond, e.g.a first wafer and a second wafer, with the first wafer comprising thefirst die 100 a and the second wafer comprising the second dice 100 b).

The preferred embodiment of FIG. 3C comprises two memory dice 100 a 1,100 a 2 and a logic die 100 b. To avoid confusion, the dice 100 a 1, 100a 2 are referred to as memory dice instead of first dice; and, the die100 b is referred to as the logic die instead of the second die. Each ofthe memory dice 100 a 1, 100 a 2 comprises a plurality of 3D-M arrays170. The memory dice 100 a 1, 100 a 2 are vertically stacked andcommunicatively coupled by the through-silicon vias (TSV's) 160 y. Thestack of the memory dice 100 a 1, 100 a 2 is communicatively coupledwith the logic die 100 b through the micro-bumps 160 x. The TSV's 160 yand the micro-bumps 160 x realize the inter-die connections 160. In thispreferred embodiment, the logic circuits 180 on the logic die 100 bprocess data from both memory dice 100 a 1, 100 a 2. Similar to FIG. 3B,the logic and memory dice 100 b, 100 a 1, 100 a 2 have same die sizes.

In FIG. 3D, a first dielectric layer 168 a is deposited on top of thefirst die 100 a and first vias 160 za are etched in the first dielectriclayer 168 a. Then a second dielectric layer 168 b is deposited on top ofthe second die 100 b and second vias 160 zb are etching in the seconddielectric layer 168 b. After flipping the second die 100 b and aligningthe first and second vias 160 za, 160 zb, the first and second dice 100a, 100 b are bonded. Finally, the first and second dice 100 a, 100 b arecommunicatively coupled by the contacted first and second vias 160 za,160 zb, which realizes the inter-die connections 160. Because they canbe made with the standard manufacturing process, the first and secondvias 160 za, 160 zb are small and numerous. As a result, the inter-dieconnections 160 have a large bandwidth. In this preferred embodiment,the first and second vias 160 za, 160 zb are collectively referred to asvertical interconnect accesses (VIA's). Similar to FIG. 3B, the firstand second dice 100 a, 100 b have same die sizes.

In the above embodiments, the memory circuit 170 and the processingcircuit 180 are close (relative to the conventional von Neumannarchitecture). In addition, for the embodiments of FIGS. 3B-3D, moreparticularly for the embodiments of FIGS. 3C-3D, the inter-dieconnections (e.g. TSV's, or VIA's) 160 are numerous. They can realize alarge bandwidth between the memory circuit 170 and the processingcircuit 180. Adding massive parallelism (FIG. 2A), the preferreddiscrete 3-D processor 100 can achieve great performance.

Referring now to FIGS. 4A-4D, four preferred first dice 100 a comprising3D-M arrays 170 are shown. Each of the 3D-M arrays 170 uses monolithicintegration per se, i.e. the memory cells are vertically stacked withoutany semiconductor substrate therebetween.

Based on its physical structure, the 3D-M can be categorized intohorizontal 3D-M (3D-M_(H)) and vertical 3D-M (3D-M_(V)). In a 3D-M_(H),all address lines are horizontal. The memory cells form a plurality ofhorizontal memory levels which are vertically stacked above each other.A well-known 3D-M_(H) is 3D-XPoint. In a 3D-M_(V), at least one set ofthe address lines are vertical. The memory cells form a plurality ofvertical memory strings which are placed side-by-side on/above thesubstrate. A well-known 3D-M_(V) is 3D-NAND. In general, the 3D-M_(H)(e.g. 3D-XPoint) is faster, while the 3D-M_(V) (e.g. 3D-NAND) is denser.

Based on the data storage time, the 3D-M can be categorized into 3D-RAM(random-access memory) and 3D-ROM (read-only memory). The 3D-RAM canstore data for short term and can be used as cache. The 3D-ROM can storedata for long term. It is a non-volatile memory (NVM). Most 3D-M arraysin the present invention are 3D-ROM.

Based on the programming methods, the 3D-M can be categorized into 3-Dwritable memory (3D-W) and 3-D printed memory (3D-P). The 3D-W cells areelectrically programmable. Based on the number of programmings allowed,the 3D-W can be further categorized into three-dimensionalone-time-programmable memory (3D-OTP) and three-dimensionalmultiple-time-programmable memory (3D-MTP, including re-programmable).Common 3D-MTP includes 3D-XPoint and 3D-NAND. Other 3D-MTP's includememristor, resistive random-access memory (RRAM or ReRAM), phase-changememory (PCM), programmable metallization cell (PMC) memory,conductive-bridging random-access memory (CBRAM), and the like.

For the 3D-P, data are recorded into the 3D-P cells using a printingmethod during manufacturing. These data are fixedly recorded and cannotbe changed after manufacturing. The printing methods includephoto-lithography, nano-imprint, e-beam lithography, DUV lithography,and laser-programming, etc. An exemplary 3D-P is three-dimensionalmask-programmed read-only memory (3D-MPROM), whose data are recorded byphoto-lithography. Because a 3D-P cell does not require electricalprogramming and can be biased at a larger voltage during read than the3D-W cell, the 3D-P is faster.

In FIGS. 4A-4B, the first die 100 a comprises a substrate circuit 0Kaand a plurality of 3D-M_(H) arrays 170 vertically stacked thereon. Thesubstrate circuit 0Ka includes transistors 0 t and substrateinterconnects 0 ia. The transistors 0 t are disposed on a firstsemiconductor substrate 0 a and communicatively coupled by the substrateinterconnects 0 ia. The substrate interconnects 0 ia include twointerconnect layers 0 m 1 a-0 m 2 a, each of which comprises a pluralityof interconnects 0 m on a same physical plane. The 3D-M_(H) array 170includes four address-line layers 0 a 1 a-0 a 4 a. Each address-linelayer (e.g. 0 a 1 a) comprises a plurality of address lines (e.g. 1 a)on a same physical plane. These address-line layers 0 a 1 a-0 a 4 a formtwo memory levels 16A, 16B, with the memory level 16A stacked on thesubstrate circuit 0Ka and the memory level 16B stacked on the memorylevel 16A. Memory cells (e.g. 7 aa) are disposed at the intersectionsbetween two address lines (e.g. 1 a, 2 a). The memory levels 16A, 16Bare communicatively coupled with the substrate circuit 0Ka throughcontact vias 1 av, 3 av, which form intra-die connections 150. Thecontact vias 1 av, 3 av comprise a plurality of vias, each of whichpenetrates through a dielectric level and communicatively couples thevias above and below. In these figures, the substrate circuit 0Kacomprises at least a portion of the peripheral circuits of the 3D-M_(H)arrays 170. In some embodiments, the substrate circuit 0Ka may alsocomprise a portion of the logic circuit.

The 3D-M_(H) arrays 170 in FIG. 4A are 3D-W arrays. Its memory cell 7 aacomprises a programmable layer 5 and a diode layer 6. The programmablelayer 5 could be an antifuse layer (which can be programmed once andused for the 3D-OTP) or a resistive RAM (RRAM) layer (which can bere-programmed and used for the 3D-MTP). The diode layer 6 is broadlyinterpreted as any layer whose resistance at the read voltage issubstantially lower than when the applied voltage has a magnitudesmaller than or polarity opposite to that of the read voltage. The diodecould be a semiconductor diode (e.g. p-i-n silicon diode), or ametal-oxide (e.g. TiO₂) diode.

The 3D-M_(H) arrays 170 in FIG. 4B are 3D-P arrays. It has at least twotypes of memory cells: a high-resistance memory cell 7 ab, and alow-resistance memory cell 7 ac. The low-resistance memory cell 7 accomprises a diode layer 6, which is similar to that in the 3D-W;whereas, the high-resistance memory cell 7 ab comprises at least ahigh-resistance layer 9, which could simply be a layer of insulatingdielectric (e.g. silicon oxide, or silicon nitride). It can bephysically removed at the location of the low-resistance memory cell 7ac during manufacturing.

In FIGS. 4C-4D, the first die 100 a comprises a substrate circuit 0Kaand a plurality of 3D-M_(V) arrays 170 vertically stacked thereon. Thesubstrate circuit 0Ka is similar to those in FIGS. 4A-4B. In someembodiments of the 3D-M_(V), there is no substrate circuit 0Ka under the3D-M_(V) arrays 170. The 3D-M_(V) array 170 comprises a plurality ofvertically stacked horizontal address-line layers 0 a 1 a-0 a 8 a. Eachhorizontal address-line layer (e.g. 0 a 5 a) comprises a plurality ofhorizontal address lines (e.g. 15) on a same physical plane. The3D-M_(V) array 170 also comprises a set of vertical address lines, whichare perpendicular to the surface of the substrate 0 a. The 3D-M_(V) hasthe largest storage density among semiconductor memories. For reason ofsimplicity, the intra-die connections 150 between the 3D-M_(V) arrays170 and the substrate circuit 0Ka are not shown. They are well known tothose skilled in the art.

The preferred 3D-M_(V) array 170 in FIG. 4C is based on verticaltransistors or transistor-like devices. It comprises a plurality ofvertical memory strings 16X, 16Y placed side-by-side. Each memory string(e.g. 16Y) comprises a plurality of vertically stacked memory cells(e.g. 18 ay-18 hy). Each memory cell (e.g. 18 fy) comprises a verticaltransistor, which includes a gate (acts as a horizontal address line)15, a storage layer 17, and a vertical channel (acts as a verticaladdress line) 19. The storage layer 17 could compriseoxide-nitride-oxide layers, oxide-poly silicon-oxide layers, or thelike. This preferred 3D-M_(V) array 170 is a 3D-NAND and itsmanufacturing details are well known to those skilled in the art.

The preferred 3D-M_(V) array 170 in FIG. 4D is based on vertical diodesor diode-like devices. In this preferred embodiment, the 3D-M_(V) arraycomprises a plurality of vertical memory strings 16U-16W placedside-by-side. Each memory string (e.g. 16U) comprises a plurality ofvertically stacked memory cells (e.g. 18 au-18 hu). The 3D-M_(V) array170 comprises a plurality of horizontal address lines (word lines) 15which are vertically stacked above each other. After etching through thehorizontal address lines 15 to form a plurality of vertical memory wells11, the sidewalls of the memory wells 11 are covered with a programmablelayer 13. The memory wells 11 are then filled with a conductivematerials to form vertical address lines (bit lines) 19. The conductivematerials could comprise metallic materials or doped semiconductormaterials. The memory cells 18 au-18 hu are formed at the intersectionsof the word lines 15 and the bit line 19. The programmable layer 13could be one-time-programmable (OTP, e.g. an antifuse layer) ormultiple-time-programmable (MTP, e.g. an RRAM layer).

To minimize interference between memory cells, a diode is preferablyformed between the word line 15 and the bit line 19. In a firstembodiment, this diode is the programmable layer 13 per se, which couldhave an electrical characteristic of a diode. In a second embodiment,this diode is formed by depositing an extra diode layer on the sidewallof the memory well (not shown in this figure). In a third embodiment,this diode is formed naturally between the word line 15 and the bit line19, i.e. to form a built-in junction (e.g. P-N junction, or Schottkyjunction). More details on the built-in diode are disclosed in U.S.patent application Ser. No. 16/137,512, filed on Sep. 20, 2018.

Referring now to FIG. 5 , a preferred second die 100 b is disclosed. Itis a conventional 2-D circuit 0Kb comprising transistors 0 t andinterconnects 0 ib. The transistors 0 t are formed on a secondsemiconductor substrate Ob and communicatively coupled by theinterconnects 0 ib. In this embodiment, the interconnects 0 ib comprisesfour interconnect layers 0 m 1 b-0 m 4 b. Each interconnect layer (e.g.0 m 1 b) comprises a plurality of interconnects (e.g. 0 m) on a samephysical plane.

Comparing the first die 100 a (FIGS. 4A-4D) and the second die 100 b(FIG. 5 ), the number of the BEOL layers in the first die 100 a is morethan that in the second die 100 b. For example, the first die 100 a inFIGS. 4A-4B comprises six BEOL layers (0 m 1 a-0 m 2 a, 0 a 1 a-0 a 4a), while the first die 100 a in FIGS. 4C-4D comprises ten BEOL layers(0 m 1 a-0 m 2 a, 0 a 1 a-0 a 8 a), both of which are larger than thefour BEOL layers (0 m 1 b-0 m 4 b) of the second die 100 b in FIG. 5 .Even the number of the address-line layers in the first die 100 a islarger than or equal to the number of BEOL layers (i.e. interconnectlayers) of the second die 100 b. More particularly, for the 3D-M_(V)arrays 170, the number of the address-line layers (roughly equal to thenumber of memory cells on each memory string, is approaching one hundredand increasing) is substantially larger than (e.g. at least twice asmuch as) the number of interconnects 0 ib (e.g. four) in the second die100 b.

On the other hand, because the second die 100 b is designed andmanufactured independently, the number of the interconnect layers in itsinterconnects 0 ib is larger than the number of the interconnect layersin the substrate circuit 0Ka of the first die 100 a. For example, thesecond die 100 b of FIG. 5 comprises four interconnect layers (0 m 1 b-0m 4 b), larger than the two interconnect layers (0 m 1 a-0 m 2 a) of thefirst die 100 a in FIGS. 4A-4D. As a result, the circuit layout on thesecond die 100 b is much easier than the first die 100 a (or, theintegrated 3-D processor 80). Moreover, the second die 100 b maycomprise high-speed interconnect materials (e.g. copper), while thesubstrate circuit 0 ia of the first die 100 a (or, the integrated 3-Dprocessor 80) could only use high-temperature interconnect materials(e.g. tungsten), which generally are slower.

Referring now to FIGS. 6A-6BB, a preferred first die 100 a and twopreferred second dice 100 b in two preferred 3-D processors 100 areshown. These figures disclose more details than FIG. 2C. The preferredembodiment in these figures corresponds to that in FIG. 7A and FIG. 8A.To those skilled in the art, these layout designs can be easily extendedto those in FIG. 7B and FIG. 8B, as well as FIG. 7C And FIG. 8C.

In FIG. 6A, the preferred first die 100 a comprises a plurality of 3D-Marrays 170 aa-170 mn. In FIG. 6BA, a preferred second die 100 bcomprises a plurality of logic circuits 180 aa-180 mn and a globalperipheral-circuit component 190G. The global peripheral-circuitcomponent 190G is located outside the projections of all 3D-M arrays 170aa-170 mn on the second die 100 b. The preferred 3-D processor 100 inFIG. 6A and FIG. 6BA adopts an “all-matching” design, i.e. the circuitson the first and second dice 100 a, 100 b are designed in such a waythat each 3D-M array (e.g. 170 ij) is vertically aligned andcommunicatively coupled with a logic circuit (e.g. 180 ij) when thesedice 100 a, 100 b are stacked (referring to FIGS. 8A-8C). Because eachlogic circuit (e.g. 180 ij) can be vertically aligned andcommunicatively coupled with multiple 3D-M arrays (e.g. 170 ijA-170 ijD,170 ijW-170 ijZ) (referring to FIGS. 8B-8C), the pitch of the logiccircuit (e.g. 180 ij) on the second die 100 b is an integer multiple ofthat of the 3D-M array (e.g. 170 ij) on the first die 100 a.

In FIG. 6BB, another preferred second die 100 b further comprises aplurality of local peripheral-circuit components 190 aa-190 mn.Apparently, the preferred 3-D processor 100 in FIG. 6A and FIG. 6BB mayalso adopt the “all-matching” design. For example, each localperipheral-circuit component (e.g. 190 ij) is vertically aligned andcommunicatively coupled with a 3D-M array (e.g. 170 ij). Besides thelocal peripheral-circuit components 190 aa-190 mn, the preferredembodiment of FIG. 6BB may also comprise a global peripheral-circuitcomponent 190G (not shown here). As used hereinafter, all localperipheral-circuit components 190 aa-190 mn and the globalperipheral-circuit component 190G are collectively referred to asoff-die peripheral-circuit components 190.

In the preferred embodiments of FIGS. 6A-6BB, the localperipheral-circuit component (e.g. 190 ij) generally includes at least aportion of an address decoder, a sense amplifier, a programming circuit,or others. It performs at least a portion of the read/write operation onthe memory cells in each 3D-M array (e.g. 170 ij). The globalperipheral-circuit component 190G generally includes at least a portionof a read-voltage generator, a write-voltage generator, an addresstranslator, a data translator, a data buffer, or others. Apparently,there are many ways to partition the local and global peripheral-circuitcomponents. For example, the local peripheral-circuit component may alsoinclude at least a portion of the read/write-voltage generator.

Referring now to FIGS. 7A-8C, three preferred SPU 100 ij are shown.FIGS. 7A-7C are their circuit block diagrams (for reason of simplicity,the local peripheral-circuit component 190 ij is not shown in FIGS.7A-7C) and FIGS. 8A-8C are their circuit layout views. In thesepreferred embodiments, a logic circuit 180 ij serves different number of3D-M arrays 170 ij.

In FIG. 7A, the logic circuit 180 ij serves one 3D-M array 170 ij, i.e.it processes the data stored in the 3D-M array 170 ij. In FIG. 7B, thelogic circuit 180 ij serves four 3D-M arrays 170 ijA-170 ijD, i.e. itprocesses the data stored in the 3D-M arrays 170 ijA-170 ijD. In FIG.7C, the logic circuit 180 ij serves eight 3D-M array 170 ijA-170 ijD,170 ijW-170 ijZ, i.e. it processes the data stored in the 3D-M array 170ijA-170 ijD, 170 ijW-170 ijZ. As will become apparent in FIGS. 8A-8C,the more 3D-M arrays it serves, a larger area and more functionalitiesthe logic circuit 180 ij will have. In FIGS. 7A-7C, because they arelocated on a different die 100 a than the logic circuit 180 ij(referring to FIG. 2C and FIGS. 6A-6BB), the 3D-M arrays 170 ij-170 ijZare drawn by dashed lines.

FIGS. 8A-8C disclose the circuit layouts of the second die 100 b, aswell as the projections of the 3D-M arrays 170 (physically located onthe first die 100 a) on the second die 100 b (drawn by dashed lines).The embodiment of FIG. 8A corresponds to that of FIG. 7A. In thispreferred embodiment, the logic circuit 180 ij and the off-dieperipheral-circuit component 190 ij of the SPU 100 ij are disposed onthe second semiconductor substrate Ob of the second die 100 b. They areat least partially covered by the 3D-M array 170 ij.

In this preferred embodiment, the pitch of the logic circuit 180 ij isequal to the pitch of the 3D-M array 170 ij. Because its area is smallerthan the footprint of the 3D-M array 170 ij, the logic circuit 180 ijhas limited functionalities. FIGS. 8B-8C discloses two complex logiccircuits 180 ij.

The embodiment of FIG. 8B corresponds to that of FIG. 7B. In thispreferred embodiment, the logic circuit 180 ij and the off-dieperipheral-circuit component 190 ij are disposed on the second die 100b. They are at least partially covered by four 3D-M arrays 170 ijA-170ijD. Below the four 3D-M arrays 170 ijA-170 ijD, the logic circuit 180ij can be laid out freely. Because the pitch of the logic circuit 180 ijis twice as much as the pitch of the 3D-M arrays 170 ijA-170 ijD, thelogic circuit 180 ij is four times larger than the footprints of the3D-M arrays 170 ijA-170 ijD and therefore, has more complexfunctionalities.

The embodiment of FIG. 8C corresponds to that of FIG. 7C. In thispreferred embodiment, the logic circuit 180 ij and the off-dieperipheral-circuit component 190 ij are disposed on the second die 100b. These 3D-M arrays 170 ijA-170 ijD, 170 ijW-170 ijZ are divided intotwo sets: a first set 170 ijSA includes four 3D-M arrays 170 ijA-170ijD, and a second set 170 ijSB includes four 3D-M arrays 170 ijW-170ijZ. Below the four 3D-M arrays 170 ijA-170 ijD of the first set 170ijSA, a first component 180 ijA of the logic circuit 180 ij can be laidout freely. Similarly, below the four 3D-M array 170 ijW-170 ijZ of thesecond set 170 ijSB, a second component 180 ijB of the logic circuit 180ij can be laid out freely. The first and second components 180 ijA, 180ijB collectively form the logic circuit 180 ij. In this embodiment,adjacent off-die peripheral-circuit components 190 ij are separated byphysical gaps (e.g. G) for forming the routing channel 182, 184, 186,which provide coupling between different components 180 ijA, 180 ijB, orbetween different logic circuits. Because the pitch of the logic circuit180 ij is four times as much as the pitch of the 3D-M arrays 170 ijA-170ijD, 170 ijW-170 ijZ (along the x direction), the logic circuit 180 ijis eight times larger than the footprints of the 3D-M arrays 170 ijA-170ijD, 170 ijW-170 ijZ and therefore, has even more complexfunctionalities.

Designed and manufactured separately, the first and second dice 100 a,100 b have substantially different BEOL structures. Because the BEOLstructures of the second die 100 b could be independently optimized, theoff-die peripheral-circuit components 190 and the logic circuits 180could have a lower cost and a better performance than their counterpartsin the integrated 3-D processor 80. In the following paragraphs, thediscrete 3-D processor 100 is compared with the integrated 3-D processor80 in several aspects.

First of all, because it does not include the off-die peripheral-circuitcomponent 190 and the logic circuit 180, the first die 100 a has abetter array efficiency. In addition, as a 2-D circuit, the second die100 b comprises substantially fewer BEOL layers than the integrated 3-Dprocessor, and can be made with the conventional manufacturing process.Because the wafer cost is roughly proportional to the number of BEOLlayers, the second die 100 b would have a much lower wafer cost than theintegrated 3-D processor 80. Hence, the total die cost of the discrete3-D processor 100 (which includes first and second dice 100 a, 100 b) islower than that of the integrated 3-D processor 80 (which includes asingle die). Even though the extra bonding cost is counted, the discrete3-D processor 100 still has a lower overall cost than the integrated 3-Dprocessor 80 for a given storage capacity.

Secondly, because they can be independently optimized, the off-dieperipheral-circuit components 190 and the logic circuits 180 of thepreferred discrete 3-D processor 100 have a better performance thantheir counterparts in the integrated 3-D processor 80. In one preferredembodiment, the number of the interconnect layers (e.g. four, eight, oreven more, FIG. 5 ) in the second die 100 b is more than that of thesubstrate circuits 0K (e.g. two, FIG. 1EB) of the integrated 3-Dprocessor 80 (or, the first die 100 a). In another preferred embodiment,the second die 100 b comprises high-speed interconnect materials (e.g.copper), not the high-temperature interconnect materials (e.g. tungsten)used in the integrated 3-D processor 80 (or, the first die 100 a), whichare generally slower. As a result, the discrete 3-D processor 100 has abetter overall performance than the integrated 3-D processor 80.

Lastly, in the integrated 3-D processor 80, the logic circuit is smallerand has less processing power, because it is disposed in a single die 80(e.g. within the footprint of the 3D-M array 77 on the substrate 0 inFIG. 1EA). In comparison, in the discrete 3-D processor 100, the logiccircuit 180 is larger and has more processing power, because it can bedisposed in two dice 100 a, 100 b (e.g. a first portion of the logiccircuit is disposed under the 3D-M array 170 ij of the first die 100 aof FIG. 6A, like the logic circuit 78 under the 3D-M array 77 of FIG.1EA; and, a second portion of the logic circuit is disposed in thesecond die 100 b of FIG. 6BA). In addition, designed and manufacturedseparately, the second die 100 b enjoys more flexibility in design andmanufacturing. By combining the same first die 100 a with differentsecond dice 100 b, different functionalities can be realized fordifferent applications. Better yet, these different functionalities canbe implemented in a relatively short time and under a relatively smallbudget. As a result, the discrete 3-D processor 100 has more processingpower and more flexible functionalities than the integrated 3-Dprocessor 80.

In the following paragraphs, the applications of the preferred discrete3-D processors 100 will be overviewed.

[A] Mathematical Computing

When applied to the mathematical computing, the preferred discrete 3-Dprocessor computes non-arithmetic functions. It uses memory-basedcomputation (MBC), which carries out computation primarily with the LUTstored in the 3D-M arrays (i.e. 3DM-LUT). In this field of application,the SPU 100 ij of FIG. 2A is referred to as a computing element, wherethe 3D-M array 170 stores at least a portion of a look-up table (LUT) ofa non-arithmetic function while the logic circuit 180 is an arithmeticlogic circuit (ALC).

Referring now to FIG. 9 , a computing element 100 ij is disclosed. Itincludes an input 110, an output 120, a 3D-M array 170 and an ALC 180.The 3D-M array 170 stores at least a portion of the LUT for anon-arithmetic function (or, a non-arithmetic model). The ALC 180performs arithmetic operations on selected data from the LUT 170. The3D-M array 170 and the ALC 180 are communicatively coupled by theinter-die connections 160. As mentioned before, a non-arithmeticfunction (or, non-arithmetic model) includes more operations than thearithmetic operations (i.e. addition, subtraction and multiplication)provided by the ALC 180. As it cannot be represented by a combination ofthe basic arithmetic operations, a non-arithmetic function (or,non-arithmetic model) cannot be implemented by the ALC 180 alone. It hasto be implemented by a combination of the ALC 180 and the LUT 170.

Referring now to FIGS. 10A-10C, three preferred ALC 180 are disclosed.The first preferred ALC 180 comprises an adder 180A, the secondpreferred ALC 180 comprises a multiplier 180M, with the third preferredALC 180 comprising a multiply-accumulator (MAC), which includes an adder180A and a multiplier 180M. The preferred ALC 180 could perform integerarithmetic operations, fixed-point arithmetic operations, orfloating-point arithmetic operations.

Referring now to FIGS. 11A-11B, a first preferred computing element 100ij for implementing a non-arithmetic function Y=f(X) is disclosed. Ituses the function-by-LUT method. FIG. 11A is its circuit block diagram.The ALC 180 comprises a pre-processing circuit 180R, a 3DM-LUT 170P, anda post-processing circuit 180T. The pre-processing circuit 180R convertsthe input variable (X) 110 into an address (A) of the 3DM-LUT 170P.After the data (D) at the address (A) is read out from the 3DM-LUT 170P,the post-processing circuit 180T converts it into the function value (Y)120. A residue (R) of the input variable (X) is fed into thepost-processing circuit 180T to improve the calculation precision.

FIG. 11B discloses the first preferred computing element 100 ij whichrealizes a single-precision non-arithmetic function Y=f(X). The inputvariable X 110 has 32 bits (x₃₁ . . . x₀). The pre-processing circuit180R extracts the higher 16 bits (x₃₁ . . . x₁₆) thereof and sends it asa 16-bit address A to the 3DM-LUT 170P. The pre-processing circuit 180Rfurther extracts the lower 16 bits (x₁₅ . . . x₀) and sends it as a16-bit residue R to the post-processing circuit 180T. The 3DM-LUT 170Pcomprises two 3DM-LUT's 170Q, 170R. Both 3DM-LUT's 170Q, 170R have 2 Mbcapacities (16-bit input and 32-bit output): the 3DM-LUT 170Q stores thefunctional value D1=f(A), while the 3DM-LUT 170R stores the first-orderderivative value D2=f′(A). The post-processing circuit 180T comprises amultiplier 180M and an adder 180A. The output value (Y) 190 has 32 bitsand is calculated from polynomial interpolation. In this case, thepolynomial interpolation is a first-order Taylor series:Y(X)=D1+D2*R=f(A)+f′(A)*R. To those skilled in the art, higher-orderpolynomial interpolation (e.g. higher-order Taylor series) can be usedto improve the calculation precision.

When calculating a non-arithmetic function, combining the LUT withpolynomial interpolation can achieve a high precision without using anexcessively large LUT. For example, if only LUT (without any polynomialinterpolation) is used to realize a single-precision function (32-bitinput and 32-bit output), it would have a capacity of 232*32=128 Gb,which is impractical. By including polynomial interpolation,significantly smaller LUT's can be used. In the above embodiment, asingle-precision function can be realized using a total of 4 Mb LUT (2Mb for function values, and 2 Mb for first-derivative values) inconjunction with a first-order Taylor series calculation. This issignificantly less than the LUT-only approach (4 Mb vs. 128 Gb).

Besides elementary functions (including algebraic functions andtranscendental functions), the preferred 3-D processor 100 can be usedto implement non-elementary functions such as special functions. Specialfunctions can be defined by means of power series, generating functions,infinite products, repeated differentiation, integral representation,differential difference, integral, and functional equations,trigonometric series, or other series in orthogonal functions. Importantexamples of special functions are gamma function, beta function,hyper-geometric functions, confluent hyper-geometric functions, Besselfunctions, Legrendre functions, parabolic cylinder functions, integralsine, integral cosine, incomplete gamma function, incomplete betafunction, probability integrals, various classes of orthogonalpolynomials, elliptic functions, elliptic integrals, Lame functions,Mathieu functions, Riemann zeta function, automorphic functions, andothers. The 3D-processor will simplify the calculation of specialfunctions and promote their applications in scientific computation.

Referring now to FIG. 12 , a second preferred computing element 100 ijfor implementing a composite function Y=EXP[K*log(X)]=X^(K) isdisclosed. It uses the function-by-LUT method. The preferred computingelement 100 ij comprises two 3DM-LUT's 170S, 170T and a multiplier 180M.The 3DM-LUT 170S stores the LOG( ) values, while the 3DM-LUT 170T storesthe EXPO values. The input variable X is used as an address 110 for the3DM-LUT 170S. The output Log(X) 160 s from the 3DM-LUT 170S ismultiplied by an exponent parameter K at the multiplier 180M. Themultiplication result K*LOG(X) is used as an address 160 t for the3DM-LUT 170T, whose output 120 is Y=X^(K).

The functions computed by the computing elements in FIGS. 11A-11B andFIG. 12 are combinational functions. As used hereinafter, acombinational function is a combination of at least two non-arithmeticfunctions. For example, a single-precision function is a combination offunctional values and derivative values; a composite function is acombination of two functions. Accordingly, the present inventiondiscloses a discrete 3-D processor for computing at least acombinational function, comprising: first and second 3D-M arrays, and anarithmetic logic circuit (ALC), wherein said first 3D-M array stores atleast a first portion of a first look-up table (LUT) of a firstnon-arithmetic function, said second 3D-M array stores at least a secondportion of a second LUT of a second non-arithmetic function, said ALCperforms arithmetic operations on selected data from said first orsecond LUT's; first and second dice, wherein said first die comprisessaid first and second 3D-M arrays, said second die comprises at least aportion of said ALC and an off-die peripheral-circuit component of saidfirst or second 3D-M array, said first die does not comprise saidoff-die peripheral-circuit component, said first and second dice areseparate dice communicatively coupled by a plurality of inter-dieconnections; wherein said combinational function is a combination ofsaid first and second non-arithmetic functions, said first and secondnon-arithmetic functions include more operations than the arithmeticoperations provided by said ALC.

[B] Computer Simulation

When applied to the computer simulation, the preferred discrete 3-Dprocessor computes non-arithmetic models. It still uses the MBC. The MBCbrings about significant performance improvement for computersimulation. In this field of application, the SPU 100 ij of FIG. 2A isreferred to as a computing element, where the 3D-M array 170 stores theLUT of a non-arithmetic model while the logic circuit is an ALC.

Referring now to FIG. 13 , a third preferred computing element 100 ij tosimulate the amplifier circuit 0Y of FIG. 1BA is disclosed. It uses themodel-by-LUT method. The preferred computing element 100 ij comprises a3DM-LUT 170U, an adder 180A and a multiplier 180M. The 3DM-LUT 170Ustores the data associated with the behaviors (e.g. input-outputcharacteristics) of the transistor OT. By using the input voltage value(V_(IN)) as an address 110 for the 3DM-LUT 170U, the readout 160 u ofthe 3DM-LUT 170U is the drain-current value (I_(D)). After the I_(D)value is multiplied with the negative resistance value (−R) of theresistor 0R by the multiplier 180M, the multiplication result (−R*I_(D))is added to the V_(DD) value by the adder 180A to generate the outputvoltage value (V_(OUT)) 120.

The 3DM-LUT 170U stores different forms of mathematical models. In onecase, the mathematical model stored in the 3DM-LUT 170U is rawmeasurement data, i.e. the measured input-output characteristics of thetransistor OT. One example is the measured drain current vs. the appliedgate-source voltage (I_(D)−V_(GS)) characteristics. In another case, themathematical model stored in the 3DM-LUT 170U is the smoothedmeasurement data. The raw measurement data could be smoothed using apurely mathematical method (e.g. a best-fit model). Or, this smoothingprocess can be aided by a physical transistor model (e.g. a BSIM4 V3.0transistor model). In a third case, the mathematical data stored in the3DM-LUT include not only the measured data, but also its derivativevalues. For example, the 3DM-LUT 170U stores not only the drain-currentvalues of the transistor OT (e.g. the I_(D)−V_(GS) characteristics), butalso its transconductance values (e.g. the G_(m)−V_(GS)characteristics). With derivative values, polynomial interpolation canbe used to improve the modeling precision using a reasonable-size3DM-LUT 170.

Model-by-LUT offers many advantages. By skipping twosoftware-decomposition steps (from mathematical models to mathematicalfunctions, and from mathematical functions to built-in functions), itsaves substantial modeling time and energy. Model-by-LUT may need lessLUT than function-by-LUT. Because a transistor model (e.g. BSIM4 V3.0)has hundreds of model parameters, calculating the intermediate functionsof the transistor model requires extremely large LUT's. However, iffunction-by-LUT is skipped (namely, skipping the transistor models andthe associated intermediate functions), the transistor behaviors can bedescribed using only three parameters (including the gate-source voltageV_(GS), the drain-source voltage V_(DS), and the body-source voltageV_(BS)). Hence, describing the mathematical models of the transistor OTrequires relatively small LUT's.

[C] Configurable Computing Array

When applied to configurable gate array, the preferred discrete 3-Dprocessor is a discrete 3-D configurable computing array. It can notonly customize logic functions and arithmetic functions, but alsocustomize non-arithmetic functions. In the preferred 3-D configurablecomputing array, the SPU 100 ij of FIG. 2A is also referred to as aconfigurable block

Referring now to FIGS. 14A-14B, a preferred configurable block 100 ijused in a preferred 3-D configurable computing array is disclosed. Thepreferred configurable block 100 ij comprises a 3D-M array 170 and alogic circuit 180 (FIG. 14A). The 3D-M array 170 stores at least aportion of the LUT of a non-arithmetic function. The logic circuit 180could be an arithmetic logic circuit (ALC), a configurable logic element(CLE), or a configurable interconnect (CIT). Accordingly, the preferredconfigurable block 100 ij includes the following functional blocks (FIG.14B): a configurable computing element (CCE) 400 (referring to FIGS.15A-15B), a CLE 200 (referring to FIG. 17B) and a CIT 300 (referring toFIG. 17A). The CCE 400 can realize a non-arithmetic function defined bythe LUT; the CLE 200 can realize a selected one of the logic functionsfrom a logic library; and, the CIT 300 can realize a selected one of theinterconnects from an interconnect library.

For the CCE 400, its input port IN includes input data 410, the outputport OUT includes output data 420, and the configuration port CFGincludes at least a configuration signal 430. When the configurationsignal 430 is “write”, the LUT of a non-arithmetic function is loadedinto the CCE 400; when the configuration signal 430 is “read”, thevalues of the non-arithmetic function are read out from the CCE 400.FIGS. 15A-15B disclose two preferred CCE's 400. In FIG. 15A, the CCE 400is simply a 3D-M array 170, which stores the functional values of thenon-arithmetic function. In FIG. 15B, the CCE 400 is a combination of a3D-M array 170 and an ALC 180. The 3D-M array 170 stores the functionalvalues and the derivative values of the non-arithmetic function, whilethe ALC 180 performs polynomial interpolation with these values.

Referring now to FIG. 16 , two usage cycles 620, 660 of a CCE are shown.Because its 3D-M arrays 170 are re-programmable, this configurablecomputing array can realize re-configurable computing. The first usagecycle 620 comprises two stages: a configuration stage 610 and acomputation stage 630. At the configuration stage 610, the LUT of afirst function is loaded into the 3D-M array 170. At the computationstage 630, the values of the first function are read out from the 3D-Marray 170. Similarly, the second usage cycle 660 also comprises aconfiguration stage 650 and a computation stage 670. This preferredembodiment is particularly suitable for single-instruction-multiple-data(SIMD)-type of data processing. Once the LUTs are loaded into the 3D-Marray 170 in the configuration stage, a large amount of data can be fedinto the CCE 400 and processed in high speed. SIMD has manyapplications, e.g. vector processing in image processing, massivelyparallel processing in scientific computing.

Referring now to FIGS. 17A-17B, an interconnect library and a logiclibrary are shown. FIG. 17A shows the interconnect library supported bya CIT 300. An interconnect library is a collection of all interconnectssupported by the CIT 300. This interconnect library includes thefollowings: a) the interconnects 302/304 are coupled, the interconnects306/308 are coupled, but 302/304 are not connected with 306/308; b) theinterconnects 302/304/306/308 are all coupled; c) the interconnects306/308 are coupled, but the interconnects 302, 304 are not coupled,neither are 302, 304 connected with 306/308; d) the interconnects302/304 are coupled, but the interconnects 306, 308 are not coupled,neither are 306, 308 connected with 302/304; e) interconnects 302, 304,306, 308 are not coupled at all. As used hereinafter, the symbol “/”between two interconnects means that these two interconnects arecoupled, while the symbol “,” between two interconnects means that thesetwo interconnects are not coupled. More details on the CIT's aredisclosed in Freeman.

FIG. 17B shows the logic library supported by a CLE 200. A logic libraryis a collection of all logic functions supported by the CLE 200. In thispreferred embodiment, the inputs A and B are input data 210, 220, andthe output C is the output data 230, the logic library includes thefollowings: C=A, NOT A, A shift by n bits, AND(A,B), OR(A,B), NAND(A,B),NOR(A,B), XOR(A,B), A+B, A−B. To facilitate pipelining, the CLE 200 maycomprise sequential logic such as flip-flops and registers. More detailson the CLE's are disclosed in Freeman.

Referring now to FIG. 18 , a first preferred 3-D configurable computingarray 100 is disclosed. It comprises first and second configurableslices 100A, 1001B. Each configurable slice (e.g. 100A) comprises afirst array of CCE's (e.g. 400AA-400AD) and a second array of CLE's(e.g. 200AA-200AD). A configurable channel 320 is placed between thefirst array of CCE's (e.g. 400AA-400AD) and the second array of CLE's(e.g. 200AA-200AD). The configurable channels 310, 330, 350 are alsoplaced between different configurable slices 100A, 100B. Theconfigurable channels 310-350 comprise an array of CIT's 300. For thoseskilled in the art, besides configurable channels, sea-of-gates may alsobe used.

Complex functions are common in computing. As used hereinafter, acomplex function is a non-arithmetic function with multiple inputindependent variables (or, arguments); whereas, a basic function is anon-arithmetic function with a single input independent variable. Ingenerally, a complex function can be expressed as a combination of basicfunctions. The preferred 3-D configurable computing array can customizecomplex functions, which is unimaginable for prior art. To customize acomplex function, the complex function is first decomposed into a numberof basic functions. Each basic function is then realized by loading itsLUT's into the associated CCE's. Finally, the complex function isrealized by programming the corresponding CLE's and CIT's.

FIG. 19 shows an instantiation of the first preferred 3-D configurablecomputing array 100 for customizing a complex functione=a·SIN(b)+c·COS(d). The CIT's 300 in the configurable channel 310-350use the same convention as FIG. 17A: the interconnects with dots at theintersection mean that the interconnects are connected; theinterconnects without dots at the intersection mean that theinterconnects are not connected; a broken interconnect means that twobroken sections are two un-coupled interconnect lines. In thisinstantiation, the CCE 400AA is configured to realize the function LOG(), whose result LOG(a) is sent to a first input of the CLE 200AA. TheCCE 400AB is configured to realize the function LOG[SINO], whose resultLOG[SIN(b)] is sent to a second input of the CLE 200AA. The CLE 200AA isconfigured to realize arithmetic addition, whose resultLOG(a)+LOG[SIN(b)] is sent the CCE 400BA. The CCE 400BA is configured torealize the function EXPO, whose result EXP{LOG(a)+LOG[SIN(b)]}=a-SIN(b)is sent to a first input of the CLE 200BA. Similarly, through properconfigurations, the results of the CCE's 400AC, 400AD, the CLE 200AC,and the CCE 400BC can be sent to a second input of the CLE 200BA. TheCLE 200BA is configured to realize arithmetic addition, whose resulta·SIN(b)+c·COS(d) is sent to the output e. Apparently, by changing itsconfiguration, the preferred 3-D configurable computing array 100 canrealize other complex functions.

Accordingly, the present invention discloses a discrete 3-D configurablecomputing array for customizing a complex function, comprising: aplurality of configurable logic elements (CLE's) and/or configurableinterconnects (CIT's); first and second CCE's, wherein said first CCEcomprises at least a first three-dimensional memory (3D-M) array forstoring at least a first portion of a first look-up table (LUT) of afirst non-arithmetic function, said second CCE comprises at least asecond 3D-M array for storing at least a second portion of a second LUTof a second non-arithmetic function; first and second dice, wherein saidfirst die comprises said 3D-M array, said second die comprises at leasta portion of said array of CCE's/CIT's and an off-die peripheral-circuitcomponent of said first or second 3D-M array, said first die does notcomprise said off-die peripheral-circuit component, said first andsecond dice are separate dice communicatively coupled by a plurality ofinter-die connections; whereby said complex function is realized byprogramming said CLE's/CIT's and said first and second CCE's, whereinsaid complex function is a combination of said first and secondnon-arithmetic functions, said first and second non-arithmetic functionsinclude more operations than the arithmetic operations provided by saidCLE's.

Referring now to FIG. 20 , a second preferred 3-D configurable computingarray 100 is shown. Besides CCE's 400A, 400B and CLE 200A, thispreferred embodiment further comprises a multiplier 500. With theaddition of the multiplier 500, the preferred 3-D configurable computingarray 100 can realize more mathematical functions and its computationalpower is more powerful.

FIGS. 21A-21B disclose two instantiations of the second preferred 3-Dconfigurable computing array 100. In the instantiation of FIG. 21A, theCCE 400A is configured to realize the function EXP(f), while the CCE400B is configured to realize the function INV(g). The configurablechannel 370 is configured in such a way that the outputs of CCE's 400A,400B are fed into the multiplier 500. The final output is thenh=EXP(f)*INV(g). On the other hand, in the instantiation of FIG. 21B,the CCE 100A is configured to realize the function SIN(f), while the CCE400B is configured to realize the function COS(g). The configurablechannel 370 is configured in such a way that the outputs of CCE's 400A,400B are fed into the CLE 200A, which is configured to realizearithmetic addition. The final output is then h=SIN(f)+COS(g).

[D] Pattern Processing

When applied to pattern processing, the preferred discrete 3-D processoris a discrete 3-D pattern processor. Its basic functionality is patternprocessing. More importantly, the patterns it processes are storedlocally.

FIG. 22 shows the architecture of a preferred discrete 3-D parallelprocessor 100. It comprises an array with m rows and n columns (m×n) ofstorage-processing units (SPU's) 100 aa-100 mn. Each SPU (e.g. 100 ij)is commutatively coupled with a common input 110 and a common output120. The input data are sent through the common input 110 to the SPU's100 aa-100 mn, where they are processed simultaneously. Because itcomprises thousands to tens of thousands of SPU's 100 aa-100 mn, thepreferred discrete 3-D parallel processor 100 supports massiveparallelism. The preferred discrete 3-D parallel processor 100 may beused for pattern processing, neural processing, and other fields ofapplications.

When used for pattern processing, the preferred 3-D parallel processor100 is a discrete 3-D pattern processor. FIG. 23 shows a SPU 100 ij usedin the preferred 3-D pattern processor 100. It comprises apattern-storage circuit 170 and a pattern-processing circuit 180communicatively coupled by a plurality of inter-die connections 160(referring to FIGS. 3A-3D). The pattern-storage circuit 170 comprises atleast a 3D-M array for storing at least a portion of a pattern, whereasthe pattern-processing circuit 180 performs pattern processing for thepattern

The preferred discrete 3-D pattern processor 100 can be eitherprocessor-like or storage-like. The processor-like 3-D pattern processor100 acts like a discrete 3-D processor with an embedded search-patternlibrary. It searches a target pattern from the input 110 against thesearch-pattern library. To be more specific, the 3D-M array 170 storesat least a portion of the search-pattern library (e.g. a virus library,a keyword library, an acoustic/language model library, an image modellibrary); the input 110 includes a target pattern (e.g. a networkpacket, a computer file, audio data, or image data); thepattern-processing circuit 180 performs pattern processing on the targetpattern with the search pattern. Because a large number of the SPU's 100ij (thousands to tens of thousands, referring to FIG. 22 ) supportmassive parallelism and the inter-die connections 160 has a largebandwidth (referring to FIGS. 3B-3D), the preferred 3-D processor withan embedded search-pattern library can achieve fast and efficientsearch.

Accordingly, the present invention discloses a discrete 3-D processorwith an embedded search-pattern library, comprising: an input fortransferring at least a portion of a target pattern; a plurality ofstorage-processing units (SPU's) communicatively coupled with saidinput, each of said SPU's comprising at least a three-dimensional memory(3D-M) array and a pattern-processing circuit, wherein said 3D-M arraystores at least a portion of a search pattern, said pattern-processingcircuit performs pattern processing on said target pattern with saidsearch pattern; first and second dice, wherein said first die comprisessaid 3D-M array, said second die comprises at least a portion of saidpattern-processing circuit and an off-die peripheral-circuit componentof said 3D-M array, said first die does not comprise said off-dieperipheral-circuit component, said first and second dice are separatedice communicatively coupled by a plurality of inter-die connections.

The storage-like discrete 3-D pattern processor 100 acts like a 3-Dstorage with in-situ pattern-processing capabilities. Its primarypurpose is to store a target-pattern database, with a secondary purposeof searching the stored target-pattern database for a search patternfrom the input 110. To be more specific, a target-pattern database (e.g.computer files on a whole disk drive, a big-data database, an audioarchive, an image archive) is stored and distributed in the 3D-M arrays170; the input 110 include at least a search pattern (e.g. a virussignature, a keyword, a model); the pattern-processing circuit 180performs pattern processing on the target pattern with the searchpattern. Because a large number of the SPU's 100 ij (thousands to tensof thousands, referring to FIG. 22 ) support massive parallelism and theinter-die connections 160 has a large bandwidth (referring to FIGS.3B-3D), the preferred 3-D storage can achieve a fast speed and a goodefficiency.

Like the flash memory, a large number of the preferred discrete 3-Dstorages 100 can be packaged into a storage card (e.g. an SD card, a TFcard) or a solid-state drive (i.e. SSD). These storage cards or SSD canbe used to store massive data in the target-pattern database. Moreimportantly, they have in-situ pattern-processing (e.g. searching)capabilities. Because each SPU 100 ij has its own pattern-processingcircuit 180, it only needs to search the data stored in the local 3D-Marray 170 (i.e. in the same SPU 100 ij). As a result, no matter howlarge is the capacity of the storage card or the SSD, the processingtime for the whole storage card or the whole SSD is similar to that fora single SPU 100 ij. In other words, the search time for a database isirrelevant to its size, mostly within seconds.

In comparison, for the conventional von Neumann architecture, theprocessor (e.g. CPU) and the storage (e.g. HDD) are physicallyseparated. During search, data need to be read out from the storagefirst. Because of the limited bandwidth between the CPU and the HDD, thesearch time for a database is limited by the read-out time of thedatabase. As a result, the search time for the database is proportionalto its size. In general, the search time ranges from minutes to hours,even longer, depending on the size of the database. Apparently, thepreferred 3-D storage with in-situ pattern-processing capabilities 100has great advantages in database search.

When a preferred 3-D storage with in-situ pattern-processingcapabilities 100 performs pattern processing for a large database (i.e.target-pattern database), the pattern-processing circuit 180 could justperform partial pattern processing. For example, the pattern-processingcircuit 180 only performs a preliminary pattern processing (e.g. codematching, or string matching) on the database. After being filtered bythis preliminary pattern-processing step, the remaining data from thedatabase are sent through the output 120 to an external processor (e.g.CPU, GPU) to complete the full pattern processing. Because most data arefiltered out by this preliminary pattern-processing step, the dataoutput from the preferred 3-D storage 100 are a small fraction of thewhole database. This can substantially alleviate the bandwidthrequirement on the output 120.

Accordingly, the present invention discloses a discrete 3-D storage within-situ pattern-processing capabilities, comprising: an input fortransferring at least a portion of a search pattern; a plurality ofstorage-processing units (SPU's) communicatively coupled with saidinput, each of said SPU's comprising at least a three-dimensional memory(3D-M) array and a pattern-processing circuit, wherein said 3D-M arraystores at least a portion of a target pattern, said pattern-processingcircuit performs pattern processing on said target pattern with saidsearch pattern; first and second dice, wherein said first die comprisessaid 3D-M array, said second die comprises at least a portion of saidpattern-processing circuit and an off-die peripheral-circuit componentof said 3D-M array, said first die does not comprise said off-dieperipheral-circuit component, said first and second dice are separatedice communicatively coupled by a plurality of inter-die connections

In the following paragraphs, applications of the preferred discrete 3-Dpattern processor 100 are described. The fields of applications include:A) information security; B) big-data analytics; C) speech recognition;and D) image recognition. Examples of the applications include: a)information-security processor; b) anti-virus storage; c) data-analysisprocessor; d) searchable storage; e) speech-recognition processor; f)searchable audio storage; g) image-recognition processor; h) searchableimage storage.

A) Information Security

Information security includes network security and computer security. Toenhance network security, virus in the network packets needs to bescanned. Similarly, to enhance computer security, virus in the computerfiles (including computer software) needs to be scanned. Generallyspeaking, virus (also known as malware) includes network viruses,computer viruses, software that violates network rules, document thatviolates document rules and others. During virus scan, a network packetor a computer file is compared against the virus patterns (also known asvirus signatures) in a virus library. Once a match is found, the portionof the network packet or the computer file which contains the virus isquarantined or removed.

Nowadays, the virus library has become large. It has reached hundreds ofMB. On the other hand, the computer data that require virus scan areeven larger, typically on the order of GB or TB, even bigger. On theother hand, each processor core in the conventional processor cantypically check a single virus pattern once. With a limited number ofcores (e.g. a CPU contains tens of cores; a GPU contains hundreds ofcores), the conventional processor can achieve limited parallelism forvirus scan. Furthermore, because the processor is physically separatedfrom the storage in the von Neumann architecture, it takes a long timeto fetch new virus patterns. As a result, the conventional processor andits associated architecture have a poor performance for informationsecurity.

To enhance information security, the present invention discloses severaldiscrete 3-D pattern processors 100. It could be processor-like orstorage-like. For processor-like, the preferred discrete 3-D patternprocessor 100 is an information-security processor, i.e. a processor forenhancing information security; for storage-like, the preferred discrete3-D pattern processor 100 is an anti-virus storage, i.e. a storage within-situ anti-virus capabilities.

a) Information-Security Processor

To enhance information security, the present invention discloses aninformation-security processor 100. It searches a network packet or acomputer file for various virus patterns in a virus library. If there isa match with a virus pattern, the network packet or the computer filecontains the virus. The preferred information-security processor 100 canbe installed as a standalone processor in a network or a computer; or,integrated into a network processor, a computer processor, or a computerstorage.

In the preferred information-security processor 100, the 3D-M arrays 170in different SPU 100 ij stores different virus patterns. In other words,the virus library is stored and distributed in the SPU's 100 ij of thepreferred information-security processor 100. Once a network packet or acomputer file is received at the input 110, at least a portion thereofis sent to all SPU's 100 ij. In each SPU 100 ij, the pattern-processingcircuit 180 compares said portion of data against the virus patternsstored in the local 3D-M array 170. If there is a match with a viruspattern, the network packet or the computer file contains the virus.

The above virus-scan operations are carried out by all SPU's 100 ij atthe same time. Because it comprises a large number of SPU's 100 ij(thousands to tens of thousands), the preferred information-securityprocessor 100 achieves massive parallelism for virus scan. Furthermore,because the inter-die connections 160 are numerous and thepattern-processing circuit 180 is physically close to the 3D-M arrays170 (compared with the conventional von Neumann architecture), thepattern-processing circuit 180 can easily fetch new virus patterns fromthe local 3D-M array 170. As a result, the preferredinformation-security processor 100 can perform fast and efficient virusscan. In this preferred embodiment, the 3D-M arrays 170 storing thevirus library could be 3D-P, 3D-OTP or 3D-MTP; and, thepattern-processing circuit 180 is a code-matching circuit.

Accordingly, the present invention discloses a discreteinformation-security processor, comprising: an input for transferring atleast a portion of data from a network packet or a computer file; aplurality of storage-processing units (SPU's) communicatively coupledwith said input, each of said SPU's comprising at least athree-dimensional memory (3D-M) array and a code-matching circuit,wherein said 3D-M array stores at least a portion of a virus pattern,said code-matching circuit searches said virus pattern in said portionof data; first and second dice, wherein said first die comprises said3D-M array, said second die comprises at least a portion of saidcode-matching circuit and an off-die peripheral-circuit component ofsaid 3D-M array, said first die does not comprise said off-dieperipheral-circuit component, said first and second dice are separatedice communicatively coupled by a plurality of inter-die connections.

b) Anti-Virus Storage

Whenever a new virus is discovered, the whole disk drive (e.g. hard-diskdrive, solid-state drive) of the computer needs to be scanned againstthe new virus. This full-disk scan process is challenging to theconventional von Neumann architecture. Because a disk drive could storemassive data, it takes a long time to even read out all data, let alonescan virus for them. For the conventional von Neumann architecture, thefull-disk scan time is proportional to the capacity of the disk drive.

To shorten the full-disk scan time, the present invention discloses ananti-virus storage. Its primary function is a computer storage, within-situ virus-scanning capabilities as its secondary function. Like theflash memory, a large number of the preferred anti-virus storage 100 canbe packaged into a storage card or a solid-state drive for storingmassive data and with in-situ virus-scanning capabilities.

In the preferred anti-virus storage 100, the 3D-M arrays 170 indifferent SPU 100 ij stores different data. In other words, massivecomputer files are stored and distributed in the SPU's 100 ij of thestorage card or the solid-state drive. Once a new virus is discoveredand a full-disk scan is required, the pattern of the new virus is sentas input 110 to all SPU's 100 ij, where the pattern-processing circuit180 compares the data stored in the local 3D-M array 170 against the newvirus pattern.

The above virus-scan operations are carried out by all SPU's 100 ij atthe same time and the virus-scan time for each SPU 100 ij is similar.Because of the massive parallelism, no matter how large is the capacityof the storage card or the solid-state drive, the virus-scan time forthe whole storage card or the whole solid-state drive is more or less aconstant, which is close to the virus-scan time for a single SPU 100 ijand generally within seconds. On the other hand, the conventionalfull-disk scan takes minutes to hours, or even longer. In this preferredembodiment, the 3D-M arrays 170 storing massive computer data arepreferably 3D-MTP; and, the pattern-processing circuit 180 is acode-matching circuit.

Accordingly, the present invention discloses a discrete anti-virusstorage, comprising: an input for transferring at least a portion of avirus pattern; a plurality of storage-processing units (SPU's)communicatively coupled with said input, each of said SPU's comprisingat least a three-dimensional memory (3D-M) array and a code-matchingcircuit, wherein said 3D-M array stores at least a portion of data, saidcode-matching circuit searches said virus pattern in said portion ofdata; first and second dice, wherein said first die comprises said 3D-Marray, said second die comprises at least a portion of saidcode-matching circuit and an off-die peripheral-circuit component ofsaid 3D-M array, said first die does not comprise said off-dieperipheral-circuit component, said first and second dice are separatedice communicatively coupled by a plurality of inter-die connections.

B) Big-Data Analytics

Big data is a term for a large collection of data, with main focus onunstructured and semi-structure data. An important aspect of big-dataanalytics is keyword search (including string matching, e.g.regular-expression matching). At present, the keyword library becomeslarge, while the big-data database is even larger. For such largekeyword library and big-data database, the conventional processor andits associated architecture can hardly perform fast and efficientkeyword search on unstructured or semi-structured data.

To improve the speed and efficiency of big-data analytics, the presentinvention discloses several discrete 3-D pattern processors 100. Itcould be processor-like or storage-like. For processor-like, thepreferred discrete 3-D pattern processor 100 is a data-analysisprocessor, i.e. a processor for performing analysis on big data; forstorage-like, the preferred discrete 3-D pattern processor 100 is asearchable storage, i.e. a storage with in-situ searching capabilities.

c) Data-Analysis Processor

To perform fast and efficient search on the input data, the presentinvention discloses a data-analysis processor 100. It searches the inputdata for the keywords in a keyword library. In the preferreddata-analysis processor 100, the 3D-M arrays 170 in different SPU 100 ijstores different keywords. In other words, the keyword library is storedand distributed in the SPU's 100 ij of the preferred data-analysisprocessor 100. Once data are received at the input 110, at least aportion thereof is sent to all SPU's 100 ij. In each SPU 100 ij, thepattern-processing circuit 180 compares said portion of data againstvarious keywords stored in the local 3D-M array 170.

The above searching operations are carried out by all SPU's 100 ij atthe same time. Because it comprises a large number of SPU's 100 ij(thousands to tens of thousands), the preferred data-analysis processor100 achieves massive parallelism for keyword search. Furthermore,because the inter-die connections 160 are numerous and thepattern-processing circuit 180 is physically close to the 3D-M arrays170 (compared with the conventional von Neumann architecture), thepattern-processing circuit 180 can easily fetch keywords from the local3D-M array 170. As a result, the preferred data-analysis processor 100can perform fast and efficient search on unstructured data orsemi-structured data.

In this preferred embodiment, the 3D-M arrays 170 storing the keywordlibrary could be 3D-P, 3D-OTP or 3D-MTP; and, the pattern-processingcircuit 180 is a string-matching circuit. The string-matching circuitcould be implemented by a content-addressable memory (CAM) or acomparator including XOR circuits. Alternatively, keyword can berepresented by a regular expression. In this case, the sting-matchingcircuit 180 can be implemented by a finite-state automata (FSA) circuit.

Accordingly, the present invention discloses a discrete data-analysisprocessor, comprising: an input for transferring at least a portion ofdata; a plurality of storage-processing units (SPU's) communicativelycoupled with said input, each of said SPU's comprising at least athree-dimensional memory (3D-M) array and a string-matching circuit,wherein said 3D-M array stores at least a portion of a keyword, saidstring-matching circuit searches said keyword in said portion of data;first and second dice, wherein said first die comprises said 3D-M array,said second die comprises at least a portion of said string-matchingcircuit and an off-die peripheral-circuit component of said 3D-M array,said first die does not comprise said off-die peripheral-circuitcomponent, said first and second dice are separate dice communicativelycoupled by a plurality of inter-die connections.

d) Searchable Storage

Big-data analytics often requires full-database search, i.e. to search awhole big-data database for a keyword. The full-database search ischallenging to the conventional von Neumann architecture. Because thebig-data database is large, with a capacity of GB to TB, or even larger,it takes a long time to even read out all data, let alone analyze them.For the conventional von Neumann architecture, the full-database searchtime is proportional to the database size.

To improve the speed and efficiency of full-database search, the presentinvention discloses a searchable storage. Its primary function isdatabase storage, with in-situ searching capabilities as its secondaryfunction. Like the flash memory, a large number of the preferredsearchable storage 100 can be packaged into a storage card or asolid-state drive for storing a big-data database and with in-situsearching capabilities.

In the preferred searchable storage 100, the 3D-M arrays 170 indifferent SPU 100 ij stores different portions of the big-data database.In other words, the big-data database is stored and distributed in theSPU's 100 ij of the storage card or the solid-state drive. Duringsearch, a keyword is sent as input 110 to all SPU's 100 ij. In each SPU100 ij, the pattern-processing circuit 180 searches the portion of thebig-data database stored in the local 3D-M array 170 for the keyword.

The above searching operations are carried out by all SPU's 100 ij atthe same time and the keyword-search time for each SPU 100 ij issimilar. Because of massive parallelism, no matter how large is thecapacity of the storage card or the solid-state drive, thekeyword-search time for the whole storage card or the whole solid-statedrive is more or less a constant, which is close to the keyword-searchtime for a single SPU 100 ij and generally within seconds. On the otherhand, the conventional full-database search takes minutes to hours, oreven longer. In this preferred embodiment, the 3D-M arrays 170 storingthe big-data database are preferably 3D-MTP; and, the pattern-processingcircuit 100 is a string-matching circuit.

Because it has the largest storage density among all semiconductormemories, the 3D-M_(V) is particularly suitable for storing a big-datadatabase. Among all 3D-M_(V), the 3D-OTP_(V) has a long data retentiontime and therefore, is particularly suitable for archiving. Fastsearchability is important for archiving. A searchable 3D-OTP_(V) willprovide a large, inexpensive archive with fast searching capabilities.

Accordingly, the present invention discloses a discrete searchablestorage, comprising: an input for transferring at least a portion of akeyword; a plurality of storage-processing units (SPU's) communicativelycoupled with said input, each of said SPU's comprising at least athree-dimensional memory (3D-M) array and a string-matching circuit,wherein said 3D-M array stores at least a portion of data, saidstring-matching circuit searches said keyword in said portion of data;first and second dice, wherein said first die comprises said 3D-M array,said second die comprises at least a portion of said string-matchingcircuit and an off-die peripheral-circuit component of said 3D-M array,said first die does not comprise said off-die peripheral-circuitcomponent, said first and second dice are separate dice communicativelycoupled by a plurality of inter-die connections.

C) Speech Recognition

Speech recognition enables the recognition and translation of spokenlanguage. It is primarily implemented through pattern recognitionbetween audio data and an acoustic model/language library, whichcontains a plurality of acoustic models or language models. Duringspeech recognition, the pattern processing circuit 180 performs speechrecognition to the user's audio data by finding the nearestacoustic/language model in the acoustic/language model library. Becausethe conventional processor (e.g. CPU, GPU) has a limited number of coresand the acoustic/language model database is stored externally, theconventional processor and the associated architecture have a poorperformance in speech recognition.

e) Speech-Recognition Processor

To improve the performance of speech recognition, the present inventiondiscloses a speech-recognition processor 100. In the preferredspeech-recognition processor 100, the user's audio data is sent as input110 to all SPU 100 ij. The 3D-M arrays 170 store at least a portion ofthe acoustic/language model. In other words, an acoustic/language modellibrary is stored and distributed in the SPUs 100 ij. Thepattern-processing circuit 180 performs speech recognition on the audiodata from the input 110 with the acoustic/language models stored in the3D-M arrays 170. In this preferred embodiment, the 3D-M arrays 170storing the models could be 3D-P, 3D-OTP, or 3D-MTP; and, thepattern-processing circuit 180 is a speech-recognition circuit.

Accordingly, the present invention discloses a discretespeech-recognition processor, comprising: an input for transferring atleast a portion of audio data; a plurality of storage-processing units(SPU's) communicatively coupled with said input, each of said SPU'scomprising at least a three-dimensional memory (3D-M) array and aspeech-recognition circuit, wherein said 3D-M array stores at least aportion of an acoustic/language model, said speech-recognition circuitperforms pattern recognition on said portion of audio data with saidacoustic/language model; first and second dice, wherein said first diecomprises said 3D-M array, said second die comprises at least a portionof said speech-recognition circuit and an off-die peripheral-circuitcomponent of said 3D-M array, said first die does not comprise saidoff-die peripheral-circuit component, said first and second dice areseparate dice communicatively coupled by a plurality of inter-dieconnections.

f) Searchable Audio Storage

To enable audio search in an audio database (e.g. an audio archive), thepresent invention discloses a searchable audio storage. In the preferredsearchable audio storage 100, an acoustic/language model derived fromthe audio data to be searched for is sent as input 110 to all SPU 100ij. The 3D-M arrays 170 store at least a portion of the user's audiodatabase. In other words, the audio database is stored and distributedin the SPUs 100 ij of the preferred searching audio storage 100. Thepattern-processing circuit 180 performs speech recognition on the audiodata stored in the 3D-M arrays 170 with the acoustic/language model fromthe input 110. In this preferred embodiment, the 3D-M arrays 170 storingthe audio database are preferably 3D-MTP; and, the pattern-processingcircuit 180 is a speech-recognition circuit.

Accordingly, the present invention discloses a discrete searchable audiostorage, comprising: an input for transferring at least a portion of anacoustic/language model; a plurality of storage-processing units (SPU's)communicatively coupled with said input, each of said SPU's comprisingat least a three-dimensional memory (3D-M) array and aspeech-recognition circuit, wherein said 3D-M array stores at least aportion of audio data, said speech-recognition circuit performs patternrecognition on said portion of audio data with said acoustic/languagemodel; first and second dice, wherein said first die comprises said 3D-Marray, said second die comprises at least a portion of saidspeech-recognition circuit and an off-die peripheral-circuit componentof said 3D-M array, said first die does not comprise said off-dieperipheral-circuit component, said first and second dice are separatedice communicatively coupled by a plurality of inter-die connections.

D) Image Recognition or Search

Image recognition enables the recognition of images. It is primarilyimplemented through pattern recognition on image data with an imagemodel, which is a part of an image model library. During imagerecognition, the pattern processing circuit 180 performs imagerecognition to the user's image data by finding the nearest image modelin the image model library. Because the conventional processor (e.g.CPU, GPU) has a limited number of cores and the image model database isstored externally, the conventional processor and the associatedarchitecture have a poor performance in image recognition.

g) Image-Recognition Processor

To improve the performance of image recognition, the present inventiondiscloses an image-recognition processor 100. In the preferredimage-recognition processor 100, the user's image data is sent as input110 to all SPU 100 ij. The 3D-M arrays 170 store at least a portion ofthe image model. In other words, an image model library is stored anddistributed in the SPUs 100 ij. The pattern-processing circuit 180performs image recognition on the image data from the input 110 with theimage models stored in the 3D-M arrays 170. In this preferredembodiment, the 3D-M arrays 170 storing the models could be 3D-P,3D-OTP, or 3D-MTP; and, the pattern-processing circuit 180 is animage-recognition circuit.

Accordingly, the present invention discloses a discreteimage-recognition processor, comprising: an input for transferring atleast a portion of image data; a plurality of storage-processing units(SPU's) communicatively coupled with said input, each of said SPU'scomprising at least a three-dimensional memory (3D-M) array and animage-recognition circuit, wherein said 3D-M array stores at least aportion of an image model, said image-recognition circuit performspattern recognition on said portion of image data with said image model;first and second dice, wherein said first die comprises said 3D-M array,said second die comprises at least a portion of said image-recognitioncircuit and an off-die peripheral-circuit component of said 3D-M array,said first die does not comprise said off-die peripheral-circuitcomponent, said first and second dice are separate dice communicativelycoupled by a plurality of inter-die connections.

h) Searchable Image Storage

To enable image search in an image database (e.g. an image archive), thepresent invention discloses a searchable image storage. In the preferredsearchable image storage 100, an image model derived from the image datato be searched for is sent as input 110 to all SPU 100 ij. The 3D-Marrays 170 store at least a portion of the user's image database. Inother words, the image database is stored and distributed in the SPUs100 ij of the preferred searchable image storage 100. Thepattern-processing circuit 180 performs image recognition on the imagedata stored in the 3D-M arrays 170 with the image model from the input110. In this preferred embodiment, the 3D-M arrays 170 storing the imagedatabase are preferably 3D-MTP; and, the pattern-processing circuit 180is an image-recognition circuit.

Accordingly, the present invention discloses a discrete searchable imagestorage, comprising: an input for transferring at least a portion of animage model; a plurality of storage-processing units (SPU's)communicatively coupled with said input, each of said SPU's comprisingat least a three-dimensional memory (3D-M) array and animage-recognition circuit, wherein said 3D-M array stores at least aportion of image data, said image-recognition circuit performs patternrecognition on said portion of image data with said image model; firstand second dice, wherein said first die comprises said 3D-M array, saidsecond die comprises at least a portion of said image-recognitioncircuit and an off-die peripheral-circuit component of said 3D-M array,said first die does not comprise said off-die peripheral-circuitcomponent, said first and second dice are separate dice communicativelycoupled by a plurality of inter-die connections.

[E] Neural Network

When applied to neural network, the preferred discrete 3-D processor isa discrete 3-D neuro-processor. Its basic functionality is neuralprocessing. More importantly, the synaptic weights required for neuralprocessing are stored locally.

The preferred discrete 3-D neuro-processor uses the architecture of thepreferred discrete 3-D parallel processor 100 (FIG. 22 ). FIG. 24 showsa SPU 100 ij used in a preferred 3-D neuro-processor 100. It comprises aneuro-storage circuit 170 and a neuro-processing circuit 180communicatively coupled by a plurality inter-die connections 160(referring to FIGS. 3A-3D). The neuro-storage circuit 170 comprises atleast a 3D-M array for storing at least a portion of a synaptic weight,whereas the neuro-processing circuit 180 performs neural processing withthe synaptic weight.

Referring now to FIGS. 25-26B, a preferred neuro-processing circuit 180and its computing circuit 730 are disclosed. In the preferred embodimentof FIG. 25 , the preferred neuro-processing circuit 180 comprises asynaptic-weight (W_(s)) RAM 740A, an input-neuron (Nin) RAM 740B, and acomputing circuit 730. The W_(s) RAM 740A is a buffer RAM whichtemporarily stores the synaptic weights 742 read from the 3D-M array(s)170. The Nin RAM 740B is another buffer RAM which temporarily stores theinput data 746 from the input 110. The computing circuit 730 performsneural processing before generating output data 748.

In the preferred embodiment of FIG. 26A, a first preferred computingcircuit 730 comprises a multiplier 732, an adder 734, a register 736 andan activation-function circuit 738. The multiplier 732 multiplies theinput data x_(i) with the synaptic weight w_(ij). Then the adder 734 andthe register 736 together perform accumulative addition for themultiplication results (i.e. w_(ij)*x_(i)). The resulting accumulativesum 737 is passed through the activation-function circuit 738 togenerate the output data y_(j).

In the preferred embodiment of FIG. 26B, a second preferred computingcircuit 730 comprises a multiply-accumulate circuit (MAC) 732′ in placeof the multiplier 732 of FIG. 26A. Of course, the MAC 732′ comprises amultiplier too. The W_(s) RAM 740A outputs not only a synaptic weightw_(ij) (through port 742 w), but also a bias bi (through port 742 b).The MAC 732′ performs a biased-multiplication (i.e. w_(ij)*x_(i)+b_(j))for the input data x₁, the synaptic weight w_(ij) and the bias b_(j).

The activation function (e.g. a sigmoid function, a signum function, athreshold function, a piecewise-linear function, a step function, a tanh function, etc.) controls the amplitude of its output to be betweencertain values (e.g. between 0 and 1 or between −1 and 1). It isdifficult to realize the activation function in the past. Following thesame inventive spirit of the present invention, more particularly thatin the section of “mathematical computing”, the logic circuit 180 on thesecond die 100 b may comprise a non-volatile memory (NVM) for storingthe LUT of the activation function. The NVM is generally a read-onlymemory (ROM), more particularly a 3-D read-only memory (3D-ROM). The3D-ROM array can be further stacked above the multiplier/MAC 732 and theadder 734 and overlap them. As a result, the computing circuit 730becomes quite simple—it only needs to realize multiplication andaddition, but not activation function. The computing circuit 730 usingthe 3D-ROM array to realize the activation functions is small andtherefore, has a large computational density.

While illustrative embodiments have been shown and described, it wouldbe apparent to those skilled in the art that many more modificationsthan that have been mentioned above are possible without departing fromthe inventive concepts set forth therein. For example, the preferred 3-Dprocessor could be a micro-controller, a controller, a centralprocessing unit (CPU), a digital signal processor (DSP), a graphicprocessing unit (GPU), a network-security processor, anencryption/decryption processor, an encoding/decoding processor, aneural-network processor, or an artificial intelligence (AI) processor.These processors can be found in consumer electronic devices (e.g.personal computers, video game machines, smart phones) as well asengineering and scientific workstations and server machines. Theinvention, therefore, is not to be limited except in the spirit of theappended claims.

What is claimed is:
 1. A discrete three-dimensional (3-D) processor,comprising: a first die comprising a first semiconductor substrate andat least a 3D-M array, wherein said 3D-M array comprises memory cellsstacked above said first semiconductor substrate; a second diecomprising a second semiconductor substrate, at least a logic circuitand at least a portion of an address decoder of said 3D-M array, whereinsaid logic circuit and said portion of said address decoder comprisetransistors disposed on said second semiconductor substrate; wherein,said logic circuit processes data stored in said 3D-M array; said logiccircuit is not a portion of a peripheral circuit of said 3D-M array;said first die does not comprise said portion of said address decoder;said first and second dice are communicatively coupled by a plurality ofinter-die connections; said first and second semiconductor substratesare separate substrates.
 2. The 3-D processor according to claim 1,wherein: said 3D-M array stores at least a portion of a look-up table(LUT) of a non-arithmetic function/model; said logic circuit comprisesan arithmetic logic circuit (ALC) for performing arithmetic operationson selected data from said LUT; whereby said 3-D processor computes saidnon-arithmetic function/model, wherein said non-arithmeticfunction/model includes more operations than the arithmetic operationsprovided by said ALC; or, said 3D-M array is a portion of a configurablecomputing element (CCE) and stores at least a portion of a look-up table(LUT) of a non-arithmetic function; said logic circuit comprises atleast a configurable logic element (CLE) and/or a configurableinterconnect (CIT); whereby said 3-D processor customizes saidnon-arithmetic function by programming said CCE and said CLE/CIT,wherein said non-arithmetic function includes more operations than thearithmetic operations provided by said CLE; or, said 3-D processorfurther comprises an input for transferring at least a first portion ofa first pattern; said 3D-M array stores at least a second portion of asecond pattern; said logic circuit comprises a pattern-processingcircuit for performing pattern processing for said first and secondpatterns; or, said 3-D processor is a discrete 3-D processor withembedded search-pattern library, further comprising an input fortransferring at least a target pattern; said 3D-M array stores at leasta search pattern; said logic circuit comprises a pattern-processingcircuit for searching said target pattern for said search pattern; or,said 3-D processor is a discrete 3-D storage with in-situpattern-processing capabilities, further comprising an input fortransferring at least a search pattern; said 3D-M array stores at leasta target pattern; said logic circuit comprises a pattern-processingcircuit for searching said target pattern for said search pattern; or,said 3D-M array stores at least a portion of a synaptic weight; saidlogic circuit comprises a neuro-processing circuit for performing neuralprocessing with said synaptic weight.
 3. The 3-D processor according toclaim 1, wherein: said first and second dice are vertically stacked; or,said first and second dice are face-to-face bonded; or, said first andsecond dice have a same die size; or, a first edge of said first die isaligned with a second edge of said second die; or, the projection ofsaid 3D-M array on said second die at least partially overlaps saidlogic circuit; or, each 3D-M array is vertically aligned andcommunicatively coupled with a logic circuit; or, each logic circuit isvertically aligned and communicatively coupled with at least a 3D-Marray; or, the pitch of said logic circuit is an integer multiple of thepitch of said 3D-M array; or, said inter-die connections include bondwires, micro-bumps, through-silicon-vias (TSV's), and/or verticalinterconnect access (VIA's).
 4. The 3-D processor according to claim 1,wherein: said 3D-M array comprises a plurality of vertically stackedmemory cells without any semiconductor substrate therebetween; or, said3D-M array is a 3-D random-access memory (3D-RAM); or, said 3D-M arrayis a 3-D read-only memory (3D-ROM); or, said 3D-M array is anon-volatile memory (NVM); or, said 3D-M array is a 3-D writable memory(3D-W); or, said 3D-M array is a 3-D printed memory (3D-P); or, said3D-M array is a horizontal 3D-M (3D-M_(H)) array; or, said 3D-M array isa vertical 3D-M (3D-M_(V)) array.
 5. The 3-D processor according toclaim 1, wherein: a first number of the BEOL layers of said first die islarger than a second number of the BEOL layers of said second die; or, athird number of the address-line layers of said first die is at leasttwice as much as a fourth number of the interconnect layers of saidsecond die; or, a fifth number of the memory cells on each memory stringin said first die is at least twice as much as a sixth number of theinterconnect layers of said second die; or, a seventh number of theinterconnect layers in the substrate circuit of said first die issmaller than an eighth number of the interconnect layers of said seconddie.
 6. A discrete three-dimensional (3-D) processor, comprising: afirst die comprising a first semiconductor substrate and at least a 3D-Marray, wherein said 3D-M array comprises memory cells stacked above saidfirst semiconductor substrate; a second die comprising a secondsemiconductor substrate, at least a logic circuit and at least a portionof a sense amplifier of said 3D-M array, wherein said logic circuit andsaid portion of said sense amplifier comprise transistors disposed onsaid second semiconductor substrate; wherein, said logic circuitprocesses data stored in said 3D-M array; said logic circuit is not aportion of a peripheral circuit of said 3D-M array; said first die doesnot comprise said portion of said sense amplifier; said first and seconddice are communicatively coupled by a plurality of inter-dieconnections; said first and second semiconductor substrates are separatesubstrates.
 7. The 3-D processor according to claim 6, wherein: said3D-M array stores at least a portion of a look-up table (LUT) of anon-arithmetic function/model; said logic circuit comprises anarithmetic logic circuit (ALC) for performing arithmetic operations onselected data from said LUT; whereby said 3-D processor computes saidnon-arithmetic function/model, wherein said non-arithmeticfunction/model includes more operations than the arithmetic operationsprovided by said ALC; or, said 3D-M array is a portion of a configurablecomputing element (CCE) and stores at least a portion of a look-up table(LUT) of a non-arithmetic function; said logic circuit comprises atleast a configurable logic element (CLE) and/or a configurableinterconnect (CIT); whereby said 3-D processor customizes saidnon-arithmetic function by programming said CCE and said CLE/CIT,wherein said non-arithmetic function includes more operations than thearithmetic operations provided by said CLE; or, said 3-D processorfurther comprises an input for transferring at least a first portion ofa first pattern; said 3D-M array stores at least a second portion of asecond pattern; said logic circuit comprises a pattern-processingcircuit for performing pattern processing for said first and secondpatterns; or, said 3-D processor is a discrete 3-D processor withembedded search-pattern library, further comprising an input fortransferring at least a target pattern; said 3D-M array stores at leasta search pattern; said logic circuit comprises a pattern-processingcircuit for searching said target pattern for said search pattern; or,said 3-D processor is a discrete 3-D storage with in-situpattern-processing capabilities, further comprising an input fortransferring at least a search pattern; said 3D-M array stores at leasta target pattern; said logic circuit comprises a pattern-processingcircuit for searching said target pattern for said search pattern; or,said 3D-M array stores at least a portion of a synaptic weight; saidlogic circuit comprises a neuro-processing circuit for performing neuralprocessing with said synaptic weight.
 8. The 3-D processor according toclaim 6, wherein: said first and second dice are vertically stacked; or,said first and second dice are face-to-face bonded; or, said first andsecond dice have a same die size; or, a first edge of said first die isaligned with a second edge of said second die; or, the projection ofsaid 3D-M array on said second die at least partially overlaps saidlogic circuit; or, each 3D-M array is vertically aligned andcommunicatively coupled with a logic circuit; or, each logic circuit isvertically aligned and communicatively coupled with at least a 3D-Marray; or, the pitch of said logic circuit is an integer multiple of thepitch of said 3D-M array; or, said inter-die connections include bondwires, micro-bumps, through-silicon-vias (TSV's), and/or verticalinterconnect access (VIA's).
 9. The 3-D processor according to claim 6,wherein: said 3D-M array comprises a plurality of vertically stackedmemory cells without any semiconductor substrate therebetween; or, said3D-M array is a 3-D random-access memory (3D-RAM); or, said 3D-M arrayis a 3-D read-only memory (3D-ROM); or, said 3D-M array is anon-volatile memory (NVM); or, said 3D-M array is a 3-D writable memory(3D-W); or, said 3D-M array is a 3-D printed memory (3D-P); or, said3D-M array is a horizontal 3D-M (3D-M_(H)) array; or, said 3D-M array isa vertical 3D-M (3D-M_(V)) array.
 10. The 3-D processor according toclaim 6, wherein: a first number of the BEOL layers of said first die islarger than a second number of the BEOL layers of said second die; or, athird number of the address-line layers of said first die is at leasttwice as much as a fourth number of the interconnect layers of saidsecond die; or, a fifth number of the memory cells on each memory stringin said first die is at least twice as much as a sixth number of theinterconnect layers of said second die; or, a seventh number of theinterconnect layers in the substrate circuit of said first die issmaller than an eighth number of the interconnect layers of said seconddie.
 11. A discrete three-dimensional (3-D) processor, comprising: afirst die comprising a first semiconductor substrate and at least a 3D-Marray, wherein said 3D-M array comprises memory cells stacked above saidfirst semiconductor substrate; a second die comprising a secondsemiconductor substrate, at least a logic circuit and at least a portionof a programming circuit of said 3D-M array, wherein said logic circuitand said portion of said programming circuit comprise transistorsdisposed on said second semiconductor substrate; wherein, said logiccircuit processes data stored in said 3D-M array; said logic circuit isnot a portion of a peripheral circuit of said 3D-M array; said first diedoes not comprise said portion of said programming circuit; said firstand second dice are communicatively coupled by a plurality of inter-dieconnections; said first and second semiconductor substrates are separatesubstrates.
 12. The 3-D processor according to claim 11, wherein: said3D-M array stores at least a portion of a look-up table (LUT) of anon-arithmetic function/model; said logic circuit comprises anarithmetic logic circuit (ALC) for performing arithmetic operations onselected data from said LUT; whereby said 3-D processor computes saidnon-arithmetic function/model, wherein said non-arithmeticfunction/model includes more operations than the arithmetic operationsprovided by said ALC; or, said 3D-M array is a portion of a configurablecomputing element (CCE) and stores at least a portion of a look-up table(LUT) of a non-arithmetic function; said logic circuit comprises atleast a configurable logic element (CLE) and/or a configurableinterconnect (CIT); whereby said 3-D processor customizes saidnon-arithmetic function by programming said CCE and said CLE/CIT,wherein said non-arithmetic function includes more operations than thearithmetic operations provided by said CLE; or, said 3-D processorfurther comprises an input for transferring at least a first portion ofa first pattern; said 3D-M array stores at least a second portion of asecond pattern; said logic circuit comprises a pattern-processingcircuit for performing pattern processing for said first and secondpatterns; or, said 3-D processor is a discrete 3-D processor withembedded search-pattern library, further comprising an input fortransferring at least a target pattern; said 3D-M array stores at leasta search pattern; said logic circuit comprises a pattern-processingcircuit for searching said target pattern for said search pattern; or,said 3-D processor is a discrete 3-D storage with in-situpattern-processing capabilities, further comprising an input fortransferring at least a search pattern; said 3D-M array stores at leasta target pattern; said logic circuit comprises a pattern-processingcircuit for searching said target pattern for said search pattern; or,said 3D-M array stores at least a portion of a synaptic weight; saidlogic circuit comprises a neuro-processing circuit for performing neuralprocessing with said synaptic weight.
 13. The 3-D processor according toclaim 11, wherein: said first and second dice are vertically stacked;or, said first and second dice are face-to-face bonded; or, said firstand second dice have a same die size; or, a first edge of said first dieis aligned with a second edge of said second die; or, the projection ofsaid 3D-M array on said second die at least partially overlaps saidlogic circuit; or, each 3D-M array is vertically aligned andcommunicatively coupled with a logic circuit; or, each logic circuit isvertically aligned and communicatively coupled with at least a 3D-Marray; or, the pitch of said logic circuit is an integer multiple of thepitch of said 3D-M array; or, said inter-die connections include bondwires, micro-bumps, through-silicon-vias (TSV's), and/or verticalinterconnect access (VIA's).
 14. The 3-D processor according to claim11, wherein: said 3D-M array comprises a plurality of vertically stackedmemory cells without any semiconductor substrate therebetween; or, said3D-M array is a 3-D random-access memory (3D-RAM); or, said 3D-M arrayis a 3-D read-only memory (3D-ROM); or, said 3D-M array is anon-volatile memory (NVM); or, said 3D-M array is a 3-D writable memory(3D-W); or, said 3D-M array is a 3-D printed memory (3D-P); or, said3D-M array is a horizontal 3D-M (3D-M_(H)) array; or, said 3D-M array isa vertical 3D-M (3D-M_(V)) array.
 15. The 3-D processor according toclaim 11, wherein: a first number of the BEOL layers of said first dieis larger than a second number of the BEOL layers of said second die;or, a third number of the address-line layers of said first die is atleast twice as much as a fourth number of the interconnect layers ofsaid second die; or, a fifth number of the memory cells on each memorystring in said first die is at least twice as much as a sixth number ofthe interconnect layers of said second die; or, a seventh number of theinterconnect layers in the substrate circuit of said first die issmaller than an eighth number of the interconnect layers of said seconddie.
 16. A discrete three-dimensional (3-D) processor, comprising: afirst die comprising a first semiconductor substrate and at least a 3D-Marray, wherein said 3D-M array comprises memory cells stacked above saidfirst semiconductor substrate; a second die comprising a secondsemiconductor substrate, at least a logic circuit and at least a portionof a read-voltage generator of said 3D-M array, wherein said logiccircuit and said portion of said read-voltage generator comprisetransistors disposed on said second semiconductor substrate; wherein,said logic circuit processes data stored in said 3D-M array; said logiccircuit is not a portion of a peripheral circuit of said 3D-M array;said first die does not comprise said portion of said read-voltagegenerator; said first and second dice are communicatively coupled by aplurality of inter-die connections; said first and second semiconductorsubstrates are separate substrates.
 17. The 3-D processor according toclaim 16, wherein: said 3D-M array stores at least a portion of alook-up table (LUT) of a non-arithmetic function/model; said logiccircuit comprises an arithmetic logic circuit (ALC) for performingarithmetic operations on selected data from said LUT; whereby said 3-Dprocessor computes said non-arithmetic function/model, wherein saidnon-arithmetic function/model includes more operations than thearithmetic operations provided by said ALC; or, said 3D-M array is aportion of a configurable computing element (CCE) and stores at least aportion of a look-up table (LUT) of a non-arithmetic function; saidlogic circuit comprises at least a configurable logic element (CLE)and/or a configurable interconnect (CIT); whereby said 3-D processorcustomizes said non-arithmetic function by programming said CCE and saidCLE/CIT, wherein said non-arithmetic function includes more operationsthan the arithmetic operations provided by said CLE; or, said 3-Dprocessor further comprises an input for transferring at least a firstportion of a first pattern; said 3D-M array stores at least a secondportion of a second pattern; said logic circuit comprises apattern-processing circuit for performing pattern processing for saidfirst and second patterns; or, said 3-D processor is a discrete 3-Dprocessor with embedded search-pattern library, further comprising aninput for transferring at least a target pattern; said 3D-M array storesat least a search pattern; said logic circuit comprises apattern-processing circuit for searching said target pattern for saidsearch pattern; or, said 3-D processor is a discrete 3-D storage within-situ pattern-processing capabilities, further comprising an input fortransferring at least a search pattern; said 3D-M array stores at leasta target pattern; said logic circuit comprises a pattern-processingcircuit for searching said target pattern for said search pattern; or,said 3D-M array stores at least a portion of a synaptic weight; saidlogic circuit comprises a neuro-processing circuit for performing neuralprocessing with said synaptic weight.
 18. The 3-D processor according toclaim 16, wherein: said first and second dice are vertically stacked;or, said first and second dice are face-to-face bonded; or, said firstand second dice have a same die size; or, a first edge of said first dieis aligned with a second edge of said second die; or, the projection ofsaid 3D-M array on said second die at least partially overlaps saidlogic circuit; or, each 3D-M array is vertically aligned andcommunicatively coupled with a logic circuit; or, each logic circuit isvertically aligned and communicatively coupled with at least a 3D-Marray; or, the pitch of said logic circuit is an integer multiple of thepitch of said 3D-M array; or, said inter-die connections include bondwires, micro-bumps, through-silicon-vias (TSV's), and/or verticalinterconnect access (VIA's).
 19. The 3-D processor according to claim16, wherein: said 3D-M array comprises a plurality of vertically stackedmemory cells without any semiconductor substrate therebetween; or, said3D-M array is a 3-D random-access memory (3D-RAM); or, said 3D-M arrayis a 3-D read-only memory (3D-ROM); or, said 3D-M array is anon-volatile memory (NVM); or, said 3D-M array is a 3-D writable memory(3D-W); or, said 3D-M array is a 3-D printed memory (3D-P); or, said3D-M array is a horizontal 3D-M (3D-M_(H)) array; or, said 3D-M array isa vertical 3D-M (3D-M_(V)) array.
 20. The 3-D processor according toclaim 16, wherein: a first number of the BEOL layers of said first dieis larger than a second number of the BEOL layers of said second die;or, a third number of the address-line layers of said first die is atleast twice as much as a fourth number of the interconnect layers ofsaid second die; or, a fifth number of the memory cells on each memorystring in said first die is at least twice as much as a sixth number ofthe interconnect layers of said second die; or, a seventh number of theinterconnect layers in the substrate circuit of said first die issmaller than an eighth number of the interconnect layers of said seconddie.
 21. A discrete three-dimensional (3-D) processor, comprising: afirst die comprising a first semiconductor substrate and at least a 3D-Marray, wherein said 3D-M array comprises memory cells stacked above saidfirst semiconductor substrate; a second die comprising a secondsemiconductor substrate, at least a logic circuit and at least a portionof a write-voltage generator of said 3D-M array, wherein said logiccircuit and said portion of said write-voltage generator comprisetransistors disposed on said second semiconductor substrate; wherein,said logic circuit processes data stored in said 3D-M array; said logiccircuit is not a portion of a peripheral circuit of said 3D-M array;said first die does not comprise said portion of said write-voltagegenerator; said first and second dice are communicatively coupled by aplurality of inter-die connections; said first and second semiconductorsubstrates are separate substrates.
 22. The 3-D processor according toclaim 21, wherein: said 3D-M array stores at least a portion of alook-up table (LUT) of a non-arithmetic function/model; said logiccircuit comprises an arithmetic logic circuit (ALC) for performingarithmetic operations on selected data from said LUT; whereby said 3-Dprocessor computes said non-arithmetic function/model, wherein saidnon-arithmetic function/model includes more operations than thearithmetic operations provided by said ALC; or, said 3D-M array is aportion of a configurable computing element (CCE) and stores at least aportion of a look-up table (LUT) of a non-arithmetic function; saidlogic circuit comprises at least a configurable logic element (CLE)and/or a configurable interconnect (CIT); whereby said 3-D processorcustomizes said non-arithmetic function by programming said CCE and saidCLE/CIT, wherein said non-arithmetic function includes more operationsthan the arithmetic operations provided by said CLE; or, said 3-Dprocessor further comprises an input for transferring at least a firstportion of a first pattern; said 3D-M array stores at least a secondportion of a second pattern; said logic circuit comprises apattern-processing circuit for performing pattern processing for saidfirst and second patterns; or, said 3-D processor is a discrete 3-Dprocessor with embedded search-pattern library, further comprising aninput for transferring at least a target pattern; said 3D-M array storesat least a search pattern; said logic circuit comprises apattern-processing circuit for searching said target pattern for saidsearch pattern; or, said 3-D processor is a discrete 3-D storage within-situ pattern-processing capabilities, further comprising an input fortransferring at least a search pattern; said 3D-M array stores at leasta target pattern; said logic circuit comprises a pattern-processingcircuit for searching said target pattern for said search pattern; or,said 3D-M array stores at least a portion of a synaptic weight; saidlogic circuit comprises a neuro-processing circuit for performing neuralprocessing with said synaptic weight.
 23. The 3-D processor according toclaim 21, wherein: said first and second dice are vertically stacked;or, said first and second dice are face-to-face bonded; or, said firstand second dice have a same die size; or, a first edge of said first dieis aligned with a second edge of said second die; or, the projection ofsaid 3D-M array on said second die at least partially overlaps saidlogic circuit; or, each 3D-M array is vertically aligned andcommunicatively coupled with a logic circuit; or, each logic circuit isvertically aligned and communicatively coupled with at least a 3D-Marray; or, the pitch of said logic circuit is an integer multiple of thepitch of said 3D-M array; or, said inter-die connections include bondwires, micro-bumps, through-silicon-vias (TSV's), and/or verticalinterconnect access (VIA's).
 24. The 3-D processor according to claim21, wherein: said 3D-M array comprises a plurality of vertically stackedmemory cells without any semiconductor substrate therebetween; or, said3D-M array is a 3-D random-access memory (3D-RAM); or, said 3D-M arrayis a 3-D read-only memory (3D-ROM); or, said 3D-M array is anon-volatile memory (NVM); or, said 3D-M array is a 3-D writable memory(3D-W); or, said 3D-M array is a 3-D printed memory (3D-P); or, said3D-M array is a horizontal 3D-M (3D-M_(H)) array; or, said 3D-M array isa vertical 3D-M (3D-M_(V)) array.
 25. The 3-D processor according toclaim 21, wherein: a first number of the BEOL layers of said first dieis larger than a second number of the BEOL layers of said second die;or, a third number of the address-line layers of said first die is atleast twice as much as a fourth number of the interconnect layers ofsaid second die; or, a fifth number of the memory cells on each memorystring in said first die is at least twice as much as a sixth number ofthe interconnect layers of said second die; or, a seventh number of theinterconnect layers in the substrate circuit of said first die issmaller than an eighth number of the interconnect layers of said seconddie.
 26. A discrete three-dimensional (3-D) processor, comprising: afirst die comprising a first semiconductor substrate and at least a 3D-Marray, wherein said 3D-M array comprises memory cells stacked above saidfirst semiconductor substrate; a second die comprising a secondsemiconductor substrate, at least a logic circuit and at least a portionof a data buffer of said 3D-M array, wherein said logic circuit and saidportion of said data buffer comprise transistors disposed on said secondsemiconductor substrate; wherein, said logic circuit processes datastored in said 3D-M array; said logic circuit is not a portion of aperipheral circuit of said 3D-M array; said first die does not comprisesaid portion of said data buffer; said first and second dice arecommunicatively coupled by a plurality of inter-die connections; saidfirst and second semiconductor substrates are separate substrates. 27.The 3-D processor according to claim 26, wherein: said 3D-M array storesat least a portion of a look-up table (LUT) of a non-arithmeticfunction/model; said logic circuit comprises an arithmetic logic circuit(ALC) for performing arithmetic operations on selected data from saidLUT; whereby said 3-D processor computes said non-arithmeticfunction/model, wherein said non-arithmetic function/model includes moreoperations than the arithmetic operations provided by said ALC; or, said3D-M array is a portion of a configurable computing element (CCE) andstores at least a portion of a look-up table (LUT) of a non-arithmeticfunction; said logic circuit comprises at least a configurable logicelement (CLE) and/or a configurable interconnect (CIT); whereby said 3-Dprocessor customizes said non-arithmetic function by programming saidCCE and said CLE/CIT, wherein said non-arithmetic function includes moreoperations than the arithmetic operations provided by said CLE; or, said3-D processor further comprises an input for transferring at least afirst portion of a first pattern; said 3D-M array stores at least asecond portion of a second pattern; said logic circuit comprises apattern-processing circuit for performing pattern processing for saidfirst and second patterns; or, said 3-D processor is a discrete 3-Dprocessor with embedded search-pattern library, further comprising aninput for transferring at least a target pattern; said 3D-M array storesat least a search pattern; said logic circuit comprises apattern-processing circuit for searching said target pattern for saidsearch pattern; or, said 3-D processor is a discrete 3-D storage within-situ pattern-processing capabilities, further comprising an input fortransferring at least a search pattern; said 3D-M array stores at leasta target pattern; said logic circuit comprises a pattern-processingcircuit for searching said target pattern for said search pattern; or,said 3D-M array stores at least a portion of a synaptic weight; saidlogic circuit comprises a neuro-processing circuit for performing neuralprocessing with said synaptic weight.
 28. The 3-D processor according toclaim 26, wherein: said first and second dice are vertically stacked;or, said first and second dice are face-to-face bonded; or, said firstand second dice have a same die size; or, a first edge of said first dieis aligned with a second edge of said second die; or, the projection ofsaid 3D-M array on said second die at least partially overlaps saidlogic circuit; or, each 3D-M array is vertically aligned andcommunicatively coupled with a logic circuit; or, each logic circuit isvertically aligned and communicatively coupled with at least a 3D-Marray; or, the pitch of said logic circuit is an integer multiple of thepitch of said 3D-M array; or, said inter-die connections include bondwires, micro-bumps, through-silicon-vias (TSV's), and/or verticalinterconnect access (VIA's).
 29. The 3-D processor according to claim26, wherein: said 3D-M array comprises a plurality of vertically stackedmemory cells without any semiconductor substrate therebetween; or, said3D-M array is a 3-D random-access memory (3D-RAM); or, said 3D-M arrayis a 3-D read-only memory (3D-ROM); or, said 3D-M array is anon-volatile memory (NVM); or, said 3D-M array is a 3-D writable memory(3D-W); or, said 3D-M array is a 3-D printed memory (3D-P); or, said3D-M array is a horizontal 3D-M (3D-M_(H)) array; or, said 3D-M array isa vertical 3D-M (3D-M_(V)) array.
 30. The 3-D processor according toclaim 26, wherein: a first number of the BEOL layers of said first dieis larger than a second number of the BEOL layers of said second die;or, a third number of the address-line layers of said first die is atleast twice as much as a fourth number of the interconnect layers ofsaid second die; or, a fifth number of the memory cells on each memorystring in said first die is at least twice as much as a sixth number ofthe interconnect layers of said second die; or, a seventh number of theinterconnect layers in the substrate circuit of said first die issmaller than an eighth number of the interconnect layers of said seconddie.